Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same

Abstract

Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.

1. An insulating resin composition comprising:
 (A) a novolak epoxy resin having a biphenyl structure;  
 (B) carboxylic acid-modified acrylonitrile butadiene rubber particles;  
 (C) a triazine ring-containing cresol novolak phenolic resin having a nitrogen content of from 12 to 22% by weight;  
 (D) a phenolic hydroxyl group-containing phosphorus compound; and  
 (E) inorganic filler.  
 
     
     
       2. The insulating resin composition according to  claim 1 , wherein the ratio of the total number of hydroxyl groups in said component (C) and said component (D) to the number of epoxy groups in said component (A) is 0.6:1 to 1.3:1. 
     
     
       3. The insulating resin composition according to  claim 1 , wherein the ratio of the weight of said component (A) to the weight of said component (B) is 88/12 to 98/2. 
     
     
       4. The insulating resin composition according to  claim 1 , wherein the amount of said component (D) is 1.5 to 2.5% by weight, based on the total weight of said components (A) to (D), in terms of a phosphorus atom.