Inventor · disambiguated record
Hiroyuki Fukai
Also filed as: FUKAI HIROYUKI
7 granted patents·4 pending applications·80 citations·filing 1997–2018
83Inventor score
Files withFURUKAWA AUTOMOTIVE SYS INC3HITACHI LTD3HITACHI CHEMICAL CO LTD2FUKAI HIROYUKI1FURUKAWA ELECTRIC CO LTD1
Top patents by PatentIndex Score
11 records- 0172US6190834B1Photosensitive resin composition, and multilayer printed circuit board using the sameHITACHI LTD·Filed 1998·Granted Feb 20, 2001·44 cites·19 claims
- 0271US7572503B2Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 11, 2009·4 cites·9 claims
- 0368US6979712B2Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Dec 27, 2005·11 cites·4 claims
- 0464US10645804B2Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring boardMATSUURA MASAHARU·Filed 2012·Granted May 5, 2020·2 cites·12 claims
- 0560US11393621B2Winding wire, coil, and transformerFURUKAWA ELECTRIC CO LTD·Filed 2018·Granted Jul 19, 2022·0 cites·7 claims
- 0660US5914216AMultilayer circuit board and photosensitive resin composition used thereforHITACHI LTD·Filed 1997·Granted Jun 22, 1999·18 cites·16 claims
- 0744US2014008105A1Circuit board and method for manufacturing circuit boardFURUKAWA AUTOMOTIVE SYS INC·Filed 2013·Application pending·0 cites
- 0843US2013033842A1Board and method for manufacturing boardFURUKAWA AUTOMOTIVE SYS INC·Filed 2012·Application pending·0 cites
- 0942US2013033350A1Substrate and substrate production methodFURUKAWA AUTOMOTIVE SYS INC·Filed 2012·Application pending·0 cites
- 1038US2013112373A1Cooling device with a plurality of fin pitchesFUKAI HIROYUKI·Filed 2011·Application pending·0 cites
- 1130US6306481B1Multilayer circuit board having insulating layer with via-holesHITACHI LTD·Filed 1999·Granted Oct 23, 2001·1 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Hiroyuki Fukai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →