Inventor
IIJIMA TADASHI
JP67 patents
⚠️ This page may combine multiple inventors who share the name “IIJIMA TADASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY SEMICONDUCTOR SOLUTIONS CORP
19 patentsUS11152418B2Oct 19, 2021
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP7 citations84
US11289526B2Mar 29, 2022
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations73
US10998369B2May 4, 2021
Solid-state imaging device having an electric coupling structure
SONY SEMICONDUCTOR SOLUTIONS CORP3 citations73
US12464841B2Nov 4, 2025
Semiconductor apparatus and semiconductor apparatus manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations63
US12317627B2May 27, 2025
Semiconductor apparatus and semiconductor apparatus manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations63
US12389706B2Aug 12, 2025
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US12336317B2Jun 17, 2025
Solid-state imaging device and electronic device including coupling structures for electrically interconnecting stacked semiconductor substrates
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US12080745B2Sep 3, 2024
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US12057462B2Aug 6, 2024
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US12027558B2Jul 2, 2024
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations62
US12002833B2Jun 4, 2024
Light detecting device with multiple substrates
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11955500B2Apr 9, 2024
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11948961B2Apr 2, 2024
Solid-state imaging device and electronic device including coupling structures for electrically interconnecting stacked semiconductor substrates
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11804507B2Oct 31, 2023
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11476294B2Oct 18, 2022
Solid-state imaging device with multiple substrates
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11411037B2Aug 9, 2022
Solid-state imaging device and electronic apparatus including coupling structures for electrically interconnecting stacked semiconductor substrates
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11411036B2Aug 9, 2022
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11201185B2Dec 14, 2021
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations62
US11101313B2Aug 24, 2021
Solid-state imaging device and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations62
TOSHIBA KK
15 patentsUS6348402B1Feb 19, 2002
Method of manufacturing a copper interconnect
TOSHIBA KK87 citations98
US6100193AAug 8, 2000
Method of manufacturing a semiconductor device
TOSHIBA KK137 citations98
US5719410AFeb 17, 1998
Semiconductor device wiring or electrode
TOSHIBA KK173 citations98
US5592024AJan 7, 1997
Semiconductor device having a wiring layer with a barrier layer
TOSHIBA KK133 citations98
US5903053AMay 11, 1999
Semiconductor device
TOSHIBA KK107 citations97
US6794286B2Sep 21, 2004
Process for fabricating a metal wiring and metal contact in a semicondutor device
TOSHIBA KK55 citations96
US6291891B1Sep 18, 2001
Semiconductor device manufacturing method and semiconductor device
TOSHIBA KK69 citations96
US6150270ANov 21, 2000
Method for forming barrier layer for copper metallization
TOSHIBA KK54 citations96
US5763953AJun 9, 1998
Semiconductor device and method of manufacturing the same
TOSHIBA KK85 citations94
US5529954AJun 25, 1996
Method of diffusing a metal through a silver electrode to form a protective film on the surface of the electrode
TOSHIBA KK58 citations94
US6368951B2Apr 9, 2002
Semiconductor device manufacturing method and semiconductor device
TOSHIBA KK16 citations92
US6090699AJul 18, 2000
Method of making a semiconductor device
TOSHIBA KK35 citations92
US6787462B2Sep 7, 2004
Method of manufacturing semiconductor device having buried metal wiring
TOSHIBA KK13 citations83
US6831368B2Dec 14, 2004
Semiconductor device and method of manufacturing the same
TOSHIBA KK5 citations74
US6750143B1Jun 15, 2004
Method for forming a plating film, and device for forming the same
TOSHIBA KK7 citations74
KOMATSU MFG CO LTD
6 patentsUS7096848B2Aug 29, 2006
Direct injection diesel engine
KOMATSU MFG CO LTD32 citations93
US6314933B1Nov 13, 2001
Piston for internal combustion engines
KOMATSU MFG CO LTD74 citations93
US9382690B2Jul 5, 2016
Engine support mechanism with aftertreatment device
KOMATSU MFG CO LTD12 citations84
US7156069B2Jan 2, 2007
Direct injection diesel engine
KOMATSU MFG CO LTD14 citations84
US5996552ADec 7, 1999
Fuel injection device for engine with supercharger and method for controlling the same
KOMATSU MFG CO LTD13 citations71
US6138643AOct 31, 2000
Fuel injection device with oil seal
KOMATSU MFG CO LTD10 citations68
IIJIMA TADASHI
3 patentsUS8932530B2Jan 13, 2015
Reducing agent aqueous solution mixing device and exhaust gas post-treatment device
IIJIMA TADASHI10 citations80
US4108337AAug 22, 1978
Quantitative supply apparatus of powder coloring agent
IIJIMA TADASHI18 citations73
US8916100B2Dec 23, 2014
Reducing agent aqueous solution mixing device and exhaust gas post-treatment device
IIJIMA TADASHI5 citations69
SUGATSUNE KOGYO
3 patentsYAMASHITA SOICHI
1 patentHITACHI GE NUCLEAR ENERGY LTD
1 patentSEIYAMA HIDEYUKI
1 patentTOSHIBA AMERICA ELECTRONIC
1 patentShowing the top 50 of 67 patents by PatentIndex Score.