Inventor
ICHITANI MASAHIRO
JP52 patents
⚠️ This page may combine multiple inventors who share the name “ICHITANI MASAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
36 patentsUS5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US6232650B1May 15, 2001
Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting
HITACHI LTD94 citations98
US5571428ANov 5, 1996
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
HITACHI LTD113 citations98
US5714405AFeb 3, 1998
Semiconductor device
HITACHI LTD98 citations97
US6596561B2Jul 22, 2003
Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture
HITACHI LTD65 citations96
US6404049B1Jun 11, 2002
Semiconductor device, manufacturing method thereof and mounting board
HITACHI LTD59 citations96
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5583375ADec 10, 1996
Semiconductor device with lead structure within the planar area of the device
HITACHI LTD73 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5437915AAug 1, 1995
Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
HITACHI LTD47 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US5466888ANov 14, 1995
Packaged semiconductor device having stress absorbing film
HITACHI LTD72 citations94
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US6512176B2Jan 28, 2003
Semiconductor device
HITACHI LTD23 citations92
US6340793B1Jan 22, 2002
Semiconductor device
HITACHI LTD37 citations92
US5252854AOct 12, 1993
Semiconductor device having stacked lead structure
HITACHI LTD51 citations92
US5406028AApr 11, 1995
Packaged semiconductor device having stress absorbing film
HITACHI LTD24 citations91
US6621160B2Sep 16, 2003
Semiconductor device and mounting board
HITACHI LTD13 citations84
US6590275B2Jul 8, 2003
Ball grid array type semiconductor package having a flexible substrate
HITACHI LTD10 citations82
US6326681B1Dec 4, 2001
Semiconductor device
HITACHI LTD14 citations82
US6303982B2Oct 16, 2001
Semiconductor device
HITACHI LTD10 citations82
US6072231AJun 6, 2000
Semiconductor device
HITACHI LTD12 citations82
US6069029AMay 30, 2000
Semiconductor device chip on lead and lead on chip manufacturing
HITACHI LTD13 citations82
US5981315ANov 9, 1999
Semiconductor device
HITACHI LTD7 citations82
US5914530AJun 22, 1999
Semiconductor device
HITACHI LTD15 citations82
US5863817AJan 26, 1999
Semiconductor device
HITACHI LTD7 citations82
US5821606AOct 13, 1998
Semiconductor device
HITACHI LTD9 citations82
US6563212B2May 13, 2003
Semiconductor device
HITACHI LTD12 citations74
US6124629ASep 26, 2000
Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
HITACHI LTD3 citations74
US5869888AFeb 9, 1999
Semiconductor device with lead structure on principal surface of chip
HITACHI LTD12 citations73
US6120301ASep 19, 2000
Semiconductor device and method of manufacturing the same
HITACHI LTD11 citations68
US6100115AAug 8, 2000
Semiconductor device
HITACHI LTD1 citations63
RENESAS TECH CORP
8 patentsUS7061785B2Jun 13, 2006
Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package
RENESAS TECH CORP21 citations92
US6872597B2Mar 29, 2005
Method of manufacturing a semiconductor device and a semiconductor device
RENESAS TECH CORP13 citations92
US6764878B2Jul 20, 2004
Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate
RENESAS TECH CORP13 citations92
US6723583B2Apr 20, 2004
Method of manufacturing a semiconductor device using a mold
RENESAS TECH CORP25 citations92
US7286386B2Oct 23, 2007
Semiconductor device
RENESAS TECH CORP11 citations83
US6720208B2Apr 13, 2004
Semiconductor device
RENESAS TECH CORP2 citations74
US6759279B2Jul 6, 2004
Method of manufacturing semiconductor device having resin sealing body
RENESAS TECH CORP2 citations62
US6919622B2Jul 19, 2005
Semiconductor device
RENESAS TECH CORP0 citations52
HITACHI HOKKAI SEMICONDUCTOR
4 patentsUS6437428B1Aug 20, 2002
Ball grid array type semiconductor package having a flexible substrate
HITACHI HOKKAI SEMICONDUCTOR9 citations81
US6887739B2May 3, 2005
Method of manufacturing semiconductor package including forming a resin sealing member
HITACHI HOKKAI SEMICONDUCTOR5 citations73
US6476466B2Nov 5, 2002
Ball grid array type semiconductor package having a flexible substrate
HITACHI HOKKAI SEMICONDUCTOR4 citations73
US6448111B1Sep 10, 2002
Method of manufacturing a semiconductor device
HITACHI HOKKAI SEMICONDUCTOR4 citations73
HITACHI YONEZAWA ELECTRONICS
1 patent(unassigned)
1 patentShowing the top 50 of 52 patents by PatentIndex Score.