Inventor

ARVIN CHARLES L

US141 patents

⚠️ This page may combine multiple inventors who share the name “ARVIN CHARLES L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ARVIN CHARLES L

IBM

Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate

Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate

Method of forming a temporary test structure for device fabrication

Conductive pillar shaped for solder confinement

Dual layer stack for contact formation

Conductive pillar shaped for solder confinement

Mixed UBM and mixed pitch on a single die

Structures to enable a full intermetallic interconnect

Nanowires for pillar interconnects

Conductive pillar shaped for solder confinement

Under ball metallurgy (UBM) for improved electromigration

Method of forming a temporary test structure for device fabrication

Conductive pillar shaped for solder confinement

Multi terminal capacitor within input output path of semiconductor package interconnect

Conductive pillar shaped for solder confinement

Mixed UBM and mixed pitch on a single die

Conductive pillar shaped for solder confinement

Determining crackstop strength of integrated circuit assembly at the wafer level

Under die surface mounted electrical elements

Security mesh and method of making

Use of electrolytic plating to control solder wetting

Precision alignment of multi-chip high density interconnects

Decoupling capacitor stiffener

Lead-free solder joining of electronic structures

All intermetallic compound with stand off feature and method to make

Personalized copper block for selective solder removal

Finned contact

Direct bonded heterogeneous integration packaging structures

Anodized metal on carrier wafer

Mixed UBM and mixed pitch on a single die

Corrosion resistant aluminum bond pad structure

Structures and methods to enable a full intermetallic interconnect

Separation of alpha emitting species from plating baths

Separation of alpha emitting species from plating baths

Organic coating to inhibit solder wetting on pillar sidewalls

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Method to recover underfilled modules by selective removal of discrete components

Polygon integrated circuit (IC) packaging

GLOBALFOUNDRIES INC

Semiconductor device contact structure having stacked nickel, copper, and tin layers

Multilayered contact structure having nickel, copper, and nickel-iron layers

Electromigration-resistant lead-free solder interconnect structures

Electrodeposition systems and methods that minimize anode and/or plating solution degradation

Passivation layer topography

Photonics chip

ARVIN CHARLES L

Multi-anode system for uniform plating of alloys

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof

Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stack

Solder volume compensation with C4 process