P

Inventor

SMALLEY JEFFORY L

US38 patents
⚠️ This page may combine multiple inventors who share the name “SMALLEY JEFFORY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

33 patents
US10880994B2Dec 29, 2020

Top-side connector interface for processor packaging

INTEL CORP13 citations84
US9832876B2Nov 28, 2017

CPU package substrates with removable memory mechanical interfaces

INTEL CORP7 citations83
US9265170B2Feb 16, 2016

Integrated circuit connectors

INTEL CORP13 citations83
US9490560B2Nov 8, 2016

Multi-array bottom-side connector using spring bias

INTEL CORP10 citations81
US10455685B1Oct 22, 2019

Electronic device, socket, and spacer to alter socket profile

INTEL CORP12 citations78
US11449111B2Sep 20, 2022

Scalable, high load, low stiffness, and small footprint loading mechanism

INTEL CORP6 citations73
US10418309B1Sep 17, 2019

Mechanical seal and reservoir for microelectronic packages

INTEL CORP3 citations72
US9859636B2Jan 2, 2018

Linear edge connector with activator bar and contact load spring

INTEL CORP2 citations72
US9848510B2Dec 19, 2017

Socket loading element and associated techniques and configurations

INTEL CORP2 citations72
US9935033B2Apr 3, 2018

Heat sink coupling using flexible heat pipes for multi-surface components

INTEL CORP4 citations71
US9806003B2Oct 31, 2017

Single base multi-floating surface cooling solution

INTEL CORP3 citations71
US9780510B2Oct 3, 2017

Socket contact techniques and configurations

INTEL CORP3 citations70
US12453054B2Oct 21, 2025

Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass

INTEL CORP0 citations62
US9385444B2Jul 5, 2016

Lateral slide pick and place cover for reduced bent pins in LGA sockets

INTEL CORP2 citations62
US12315780B2May 27, 2025

Technologies for processor loading mechanisms

INTEL CORP0 citations61
US12506083B2Dec 23, 2025

Liquid metal interconnect for modular package server architecture

INTEL CORP0 citations60
US10205292B2Feb 12, 2019

Socket contact techniques and configurations

INTEL CORP1 citations60
US12309933B2May 20, 2025

Magnetically secured semiconductor chip package loading assembly

INTEL CORP0 citations59
US12279395B2Apr 15, 2025

Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention

INTEL CORP0 citations58
US12131977B2Oct 29, 2024

Electronic systems with inverted circuit board with heat sink to chassis attachment

INTEL CORP0 citations58
US11842943B2Dec 12, 2023

Electronic systems with inverted circuit board with heat sink to chassis attachment

INTEL CORP0 citations58
US11683890B2Jun 20, 2023

Reflow grid array to support late attach of components

INTEL CORP1 citations58
US11621237B2Apr 4, 2023

Interposer and electronic package

INTEL CORP0 citations58
US11545408B2Jan 3, 2023

Reflowable grid array to support grid heating

INTEL CORP0 citations58
US11488839B2Nov 1, 2022

Reflowable grid array as standby heater for reliability

INTEL CORP0 citations58
US12476167B2Nov 18, 2025

Semiconductor chip package thermo-mechanical cooling assembly

INTEL CORP0 citations52
US12519049B2Jan 6, 2026

Liquid metal interconnect for modular system on an interconnect server architecture

INTEL CORP0 citations50
US12494435B2Dec 9, 2025

Liquid metal interconnect for modular system on an interposer server architecture

INTEL CORP0 citations50
US10455731B2Oct 22, 2019

Hydraulic bladder for CPU interconnection and cooling

INTEL CORP0 citations50
US10211120B2Feb 19, 2019

Rework grid array interposer with direct power

INTEL CORP0 citations50
US9603276B2Mar 21, 2017

Electronic assembly that includes a plurality of electronic packages

INTEL CORP1 citations50
US11038293B2Jun 15, 2021

Power bar package mount arrangement

INTEL CORP0 citations45
US10141241B2Nov 27, 2018

Multi-chip self adjusting cooling solution

INTEL CORP0 citations36

HARTMAN COREY D

1 patent

RODRIGUEZ ALEJANDRO Z

1 patent

LLAPITAN DAVID J

1 patent

CHAWLA GAURAV

1 patent

SK HYNIX NAND PRODUCT SOLUTIONS CORP

1 patent