Inventor
SMALLEY JEFFORY L
US38 patents
⚠️ This page may combine multiple inventors who share the name “SMALLEY JEFFORY L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
33 patentsUS10880994B2Dec 29, 2020
Top-side connector interface for processor packaging
INTEL CORP13 citations84
US9832876B2Nov 28, 2017
CPU package substrates with removable memory mechanical interfaces
INTEL CORP7 citations83
US9265170B2Feb 16, 2016
Integrated circuit connectors
INTEL CORP13 citations83
US9490560B2Nov 8, 2016
Multi-array bottom-side connector using spring bias
INTEL CORP10 citations81
US10455685B1Oct 22, 2019
Electronic device, socket, and spacer to alter socket profile
INTEL CORP12 citations78
US11449111B2Sep 20, 2022
Scalable, high load, low stiffness, and small footprint loading mechanism
INTEL CORP6 citations73
US10418309B1Sep 17, 2019
Mechanical seal and reservoir for microelectronic packages
INTEL CORP3 citations72
US9859636B2Jan 2, 2018
Linear edge connector with activator bar and contact load spring
INTEL CORP2 citations72
US9848510B2Dec 19, 2017
Socket loading element and associated techniques and configurations
INTEL CORP2 citations72
US9935033B2Apr 3, 2018
Heat sink coupling using flexible heat pipes for multi-surface components
INTEL CORP4 citations71
US9806003B2Oct 31, 2017
Single base multi-floating surface cooling solution
INTEL CORP3 citations71
US9780510B2Oct 3, 2017
Socket contact techniques and configurations
INTEL CORP3 citations70
US12453054B2Oct 21, 2025
Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass
INTEL CORP0 citations62
US9385444B2Jul 5, 2016
Lateral slide pick and place cover for reduced bent pins in LGA sockets
INTEL CORP2 citations62
US12315780B2May 27, 2025
Technologies for processor loading mechanisms
INTEL CORP0 citations61
US12506083B2Dec 23, 2025
Liquid metal interconnect for modular package server architecture
INTEL CORP0 citations60
US10205292B2Feb 12, 2019
Socket contact techniques and configurations
INTEL CORP1 citations60
US12309933B2May 20, 2025
Magnetically secured semiconductor chip package loading assembly
INTEL CORP0 citations59
US12279395B2Apr 15, 2025
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention
INTEL CORP0 citations58
US12131977B2Oct 29, 2024
Electronic systems with inverted circuit board with heat sink to chassis attachment
INTEL CORP0 citations58
US11842943B2Dec 12, 2023
Electronic systems with inverted circuit board with heat sink to chassis attachment
INTEL CORP0 citations58
US11683890B2Jun 20, 2023
Reflow grid array to support late attach of components
INTEL CORP1 citations58
US11621237B2Apr 4, 2023
Interposer and electronic package
INTEL CORP0 citations58
US11545408B2Jan 3, 2023
Reflowable grid array to support grid heating
INTEL CORP0 citations58
US11488839B2Nov 1, 2022
Reflowable grid array as standby heater for reliability
INTEL CORP0 citations58
US12476167B2Nov 18, 2025
Semiconductor chip package thermo-mechanical cooling assembly
INTEL CORP0 citations52
US12519049B2Jan 6, 2026
Liquid metal interconnect for modular system on an interconnect server architecture
INTEL CORP0 citations50
US12494435B2Dec 9, 2025
Liquid metal interconnect for modular system on an interposer server architecture
INTEL CORP0 citations50
US10455731B2Oct 22, 2019
Hydraulic bladder for CPU interconnection and cooling
INTEL CORP0 citations50
US10211120B2Feb 19, 2019
Rework grid array interposer with direct power
INTEL CORP0 citations50
US9603276B2Mar 21, 2017
Electronic assembly that includes a plurality of electronic packages
INTEL CORP1 citations50
US11038293B2Jun 15, 2021
Power bar package mount arrangement
INTEL CORP0 citations45
US10141241B2Nov 27, 2018
Multi-chip self adjusting cooling solution
INTEL CORP0 citations36