Inventor
THIBADO JONATHAN W
US10 patents
Patents
10 patentsUS10880994B2Dec 29, 2020
Top-side connector interface for processor packaging
INTEL CORP13 citations84
US9832876B2Nov 28, 2017
CPU package substrates with removable memory mechanical interfaces
INTEL CORP7 citations83
US12219706B2Feb 4, 2025
Removable and low insertion force connector system
INTEL CORP0 citations59
US11683890B2Jun 20, 2023
Reflow grid array to support late attach of components
INTEL CORP1 citations58
US11621237B2Apr 4, 2023
Interposer and electronic package
INTEL CORP0 citations58
US11545408B2Jan 3, 2023
Reflowable grid array to support grid heating
INTEL CORP0 citations58
US11488839B2Nov 1, 2022
Reflowable grid array as standby heater for reliability
INTEL CORP0 citations58
US10211120B2Feb 19, 2019
Rework grid array interposer with direct power
INTEL CORP0 citations50
US9603276B2Mar 21, 2017
Electronic assembly that includes a plurality of electronic packages
INTEL CORP1 citations50
US12082370B2Sep 3, 2024
System device aggregation in a liquid cooling environment
INTEL CORP0 citations49