Inventor
LLAPITAN DAVID J
US18 patents
⚠️ This page may combine multiple inventors who share the name “LLAPITAN DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
16 patentsUS6671172B2Dec 30, 2003
Electronic assemblies with high capacity curved fin heat sinks
INTEL CORP115 citations98
US6585534B2Jul 1, 2003
Retention mechanism for an electrical assembly
INTEL CORP43 citations96
US7200934B2Apr 10, 2007
Electronic assemblies with high capacity heat sinks and methods of manufacture
INTEL CORP27 citations92
US6722908B2Apr 20, 2004
Retention mechanism for an electrical assembly
INTEL CORP24 citations92
US6159031ADec 12, 2000
Retention mechanism that can be used with different electronic assemblies
INTEL CORP38 citations92
US8905794B2Dec 9, 2014
Connector assembly and method
INTEL CORP10 citations84
US9832876B2Nov 28, 2017
CPU package substrates with removable memory mechanical interfaces
INTEL CORP7 citations83
US9265170B2Feb 16, 2016
Integrated circuit connectors
INTEL CORP13 citations83
US9490560B2Nov 8, 2016
Multi-array bottom-side connector using spring bias
INTEL CORP10 citations81
US9385457B2Jul 5, 2016
Connector assembly and method
INTEL CORP5 citations73
US9848510B2Dec 19, 2017
Socket loading element and associated techniques and configurations
INTEL CORP2 citations72
US7050302B2May 23, 2006
Captive socket actuator
INTEL CORP7 citations71
US6327147B1Dec 4, 2001
Retention mechanism and electronic module mounting system
INTEL CORP14 citations68
US10211120B2Feb 19, 2019
Rework grid array interposer with direct power
INTEL CORP0 citations50
US9603276B2Mar 21, 2017
Electronic assembly that includes a plurality of electronic packages
INTEL CORP1 citations50
US7867003B2Jan 11, 2011
Wire bale independent load mechanism
INTEL CORP1 citations42