Inventor · disambiguated record
Robert M. Hilton
Also filed as: HILTON LEGAL REPRESENTATIVE DZ · HILTON ROBERT M
11 granted patents·2 pending applications·242 citations·filing 1989–2013
91Inventor score
Top patents by PatentIndex Score
13 records- 0195US7144759B1Technology partitioning for advanced flip-chip packagingCELERITY RES PTE LTD·Filed 2005·Granted Dec 5, 2006·71 cites·17 claims
- 0290US6940182B2Flip-chip package with underfill dam for stress controlASE ELECTRONICS M SDN BHD·Filed 2004·Granted Sep 6, 2005·75 cites·16 claims
- 0376US6762509B2Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill materialCELERITY RES PTE LTD·Filed 2001·Granted Jul 13, 2004·24 cites·6 claims
- 0465US6984996B2Wafer probing that conditions devices for flip-chip bondingCELERITY RES INC·Filed 2003·Granted Jan 10, 2006·8 cites·10 claims
- 0565US5493985AProcess and apparatus for controlled synthesis and in-situ single crystal growth of phosphorus compounds and the crystals therefromUS ARMY·Filed 1993·Granted Feb 27, 1996·18 cites·12 claims
- 0661US6737752B2Flip-chip package containing a chip and a substrate having differing pitches for electrical connectionsCELERITY RES PTE LTD·Filed 2002·Granted May 18, 2004·9 cites·7 claims
- 0756US5431125ATwin-free crystal growth of III-V semiconductor materialUS ARMY·Filed 1991·Granted Jul 11, 1995·14 cites·14 claims
- 0853US5252175ACapillary pressure relief for magnetic Kyropoulos growth of semiconductor crystalsUS ARMY·Filed 1990·Granted Oct 12, 1993·12 cites·11 claims
- 0949US6576073B2Adhesive control during stiffener attachment to provide co-planarity in flip chip packagesCELERITY RES PTE LTD·Filed 2001·Granted Jun 10, 2003·5 cites·5 claims
- 1045US6699732B2Pitch compensation in flip-chip packagingCELERITY RES PTE LTD·Filed 2002·Granted Mar 2, 2004·2 cites·9 claims
- 1144US2013186847A1Shelving SystemsMADIX INC·Filed 2013·Application pending·0 cites
- 1241US2005231222A1Wafer probing that conditions devices for flip-chip bondingDIORIO MARK L·Filed 2005·Application pending·0 cites
- 1334US4963334AHigh temperature heat pipe coracle and processUS AIR FORCE·Filed 1989·Granted Oct 16, 1990·4 cites·12 claims
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