Inventor
BENNETT DOYLE E
US37 patents
⚠️ This page may combine multiple inventors who share the name “BENNETT DOYLE E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
30 patentsUS5984769ANov 16, 1999
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
APPLIED MATERIALS INC142 citations99
US6645061B1Nov 11, 2003
Polishing pad having a grooved pattern for use in chemical mechanical polishing
APPLIED MATERIALS INC56 citations96
US6273806B1Aug 14, 2001
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
APPLIED MATERIALS INC111 citations95
US9281253B2Mar 8, 2016
Determination of gain for eddy current sensor
APPLIED MATERIALS INC28 citations94
US7074109B1Jul 11, 2006
Chemical mechanical polishing control system and method
APPLIED MATERIALS INC50 citations93
US7621798B1Nov 24, 2009
Reducing polishing pad deformation
APPLIED MATERIALS INC19 citations92
US7247080B1Jul 24, 2007
Feedback controlled polishing processes
APPLIED MATERIALS INC29 citations92
US7024268B1Apr 4, 2006
Feedback controlled polishing processes
APPLIED MATERIALS INC43 citations92
US6572453B1Jun 3, 2003
Multi-fluid polishing process
APPLIED MATERIALS INC25 citations92
US6220941B1Apr 24, 2001
Method of post CMP defect stability improvement
APPLIED MATERIALS INC35 citations92
US6945845B2Sep 20, 2005
Chemical mechanical polishing apparatus with non-conductive elements
APPLIED MATERIALS INC20 citations91
US6251001B1Jun 26, 2001
Substrate polishing with reduced contamination
APPLIED MATERIALS INC21 citations90
US9636797B2May 2, 2017
Adjusting eddy current measurements
APPLIED MATERIALS INC11 citations84
US9205527B2Dec 8, 2015
In-situ monitoring system with monitoring of elongated region
APPLIED MATERIALS INC7 citations84
US6991516B1Jan 31, 2006
Chemical mechanical polishing with multi-stage monitoring of metal clearing
APPLIED MATERIALS INC16 citations83
US7354334B1Apr 8, 2008
Reducing polishing pad deformation
APPLIED MATERIALS INC7 citations74
US7255637B2Aug 14, 2007
Carrier head vibration damping
APPLIED MATERIALS INC7 citations74
US10556315B2Feb 11, 2020
Determination of gain for eddy current sensor
APPLIED MATERIALS INC1 citations73
US9227293B2Jan 5, 2016
Multi-platen multi-head polishing architecture
APPLIED MATERIALS INC6 citations73
US11658078B2May 23, 2023
Using a trained neural network for use in in-situ monitoring during polishing and polishing system
APPLIED MATERIALS INC1 citations72
US9056383B2Jun 16, 2015
Path for probe of spectrographic metrology system
APPLIED MATERIALS INC3 citations63
US8535121B2Sep 17, 2013
Retaining ring and articles for carrier head
APPLIED MATERIALS INC3 citations63
US8376813B2Feb 19, 2013
Retaining ring and articles for carrier head
APPLIED MATERIALS INC1 citations63
US7494929B2Feb 24, 2009
Automatic gain control
APPLIED MATERIALS INC3 citations63
US12136574B2Nov 5, 2024
Technique for training neural network for use in in-situ monitoring during polishing and polishing system
APPLIED MATERIALS INC0 citations62
US12057354B2Aug 6, 2024
Trained neural network in in-situ monitoring during polishing and polishing system
APPLIED MATERIALS INC0 citations62
US11791224B2Oct 17, 2023
Technique for training neural network for use in in-situ monitoring during polishing and polishing system
APPLIED MATERIALS INC0 citations62
US10207386B2Feb 19, 2019
Determination of gain for eddy current sensor
APPLIED MATERIALS INC1 citations62
US12447578B2Oct 21, 2025
Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoring
APPLIED MATERIALS INC0 citations48
US9275917B2Mar 1, 2016
Determination of gain for eddy current sensor
APPLIED MATERIALS INC0 citations41