Inventor

DAI FEN

CN8 patents

⚠️ This page may combine multiple inventors who share the name “DAI FEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

3 patents

US6561889B1May 13, 2003

Methods for making reinforced wafer polishing pads and apparatuses implementing the same

LAM RES CORP83 citations96

US6572463B1Jun 3, 2003

Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same

LAM RES CORP56 citations94

US6949020B2Sep 27, 2005

Methods for making reinforced wafer polishing pads and apparatuses implementing the same

LAM RES CORP13 citations82

HUAWEI TECH CO LTD

2 patents

US10678738B2Jun 9, 2020

Memory extensible chip

HUAWEI TECH CO LTD24 citations93

US10069947B2Sep 4, 2018

Method and apparatus for processing data packet based on parallel protocol stack instances

HUAWEI TECH CO LTD2 citations71

SPEEDFAM IPEC

1 patent

US6261158B1Jul 17, 2001

Multi-step chemical mechanical polishing

SPEEDFAM IPEC57 citations90

MATTSON TECH INC

1 patent

US11264249B2Mar 1, 2022

Carbon containing hardmask removal process using sulfur containing process gas

MATTSON TECH INC4 citations68

DAI FEN

1 patent

US9497035B2Nov 15, 2016

Method, device, and system for playing media based on P2P

DAI FEN3 citations65