Methods for making reinforced wafer polishing pads and apparatuses implementing the same

Abstract

As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer and a cushioning layer. In addition, the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.

What is claimed is:  
     
       1. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising: 
       a polishing pad, the polishing pad being shaped like a belt and configured to have no seams; and  
       a base belt, the base belt including a reinforcement layer and a cushioning layer;  
       wherein the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.  
     
     
       2. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , wherein the polishing pad is a polymeric material. 
     
     
       3. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 2 , wherein the polymeric material is polyurethane. 
     
     
       4. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , wherein the cushioning layer is a sponge like material. 
     
     
       5. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , wherein the cushioning layer is an open-celled polyurethane material. 
     
     
       6. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , wherein the reinforcement layer is a steel layer. 
     
     
       7. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , wherein the polishing pad is about 40 mils in thickness. 
     
     
       8. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , wherein the cushioning layer is about 20 mils in thickness. 
     
     
       9. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , further comprising: 
       a cap covering an adhesive film between the base belt and the polishing pad.  
     
     
       10. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 9 , wherein the cap is a polymeric material. 
     
     
       11. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , further comprising: 
       a cover configured to seal off an adhesive film between the base belt and the polishing pad from moisture intrusion.  
     
     
       12. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 1 , wherein the base belt and the polishing pad are attached by a first adhesive film, and the reinforcement layer and the cushioning layer are attached by a second adhesive film. 
     
     
       13. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising: 
       a polishing pad, the polishing pad being shaped like a belt and configured to have no seams; and  
       a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a steel layer;  
       wherein the cushioning layer is an intermediary layer between the continuous pad and the reinforcement layer.  
     
     
       14. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 13 , wherein the polishing pad is a polymeric material. 
     
     
       15. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 13 , wherein the polishing pad is between about 30 mils and about 100 mils in thickness. 
     
     
       16. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 13 , wherein the cushioning layer is between about 10 mils and about 100 mils in thickness. 
     
     
       17. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 13 , wherein the reinforcement layer is between about 5 mils and about 50 mils in thickness. 
     
     
       18. A polishing structure for utilization in chemical mechanical polishing, comprising: 
       a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit, the polishing pad being made of a polymeric material; and  
       a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a steel layer;  
       wherein the cushioning layer is an intermediary layer between the polishing pad and the reinforcement layer, the cushioning layer being a polymeric material.  
     
     
       19. A polishing structure for utilization in chemical mechanical polishing as recited in  claim 18 , wherein the steel layer and the cushioning layer are attached by a first adhesive film, and the cushioning layer and the polishing pad are attached by a second adhesive film. 
     
     
       20. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising: 
       a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit and to have grooves on a pad surface, the polishing pad being made up of polyurethane; and  
       a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a steel layer, the reinforcement layer and the cushioning layer being attached by way of a first adhesive film, the base belt and the polishing pad being attached by way of a second adhesive film;  
       wherein the cushioning layer is an intermediary between the polishing pad and the reinforcement layer, the cushioning layer being a polyurethane material.  
     
     
       21. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 20 , wherein the polishing pad is between about 40 mils in thickness. 
     
     
       22. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 20 , wherein the cushioning layer is about 20 mils in thickness. 
     
     
       23. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 20 , wherein the reinforcement layer is about 20 mils in thickness. 
     
     
       24. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising: 
       a polishing pad, the polishing pad being shaped like a belt and configured to be a contiguous unit;  
       a base belt, the base belt including a reinforcement layer and a cushioning layer; and  
       a cap covering an adhesive film between the base belt and the polishing pad;  
       wherein the cushioning layer is an intermediary between the continuous pad and the base belt.  
     
     
       25. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 24 , wherein the polishing pad is polyurethane. 
     
     
       26. A seamless polishing apparatus for utilization in chemical mechanical polishing as recited in  claim 24 , wherein the reinforcement layer is a steel layer. 
     
     
       27. A seamless polishing apparatus for utilization in chemical mechanical polishing, comprising: 
       a polishing pad, the polishing pad being shaped like a belt and configured to have no seams, and the polishing pad being made of a polymeric material, and the polishing pad being between about 30 mils and about 100 mils in thickness and configured to have a grooved top surface; and  
       a base belt, the base belt including a reinforcement layer and a cushioning layer, the reinforcement layer being a stainless steel layer, and the cushioning layer being between about 10 mils and about 100 mils in thickness, and the reinforcement layer being between about 5 mils and 50 mils in thickness;  
       wherein the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.  
     
     
       28. A method for generating a polishing pad structure for utilization in chemical mechanical polishing, comprising: 
       providing a reinforcement layer;  
       applying a first adhesive film over the reinforcement layer;  
       attaching a cushioning layer on the first adhesive film;  
       applying a second adhesive film over the cushioning layer;  
       attaching a seamless polishing pad on the second adhesive film; and  
       curing the polishing pad structure.  
     
     
       29. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in  claim 28  wherein the reinforcement layer is a steel layer. 
     
     
       30. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in  claim 28  wherein the first adhesive layer and the second adhesive layer is a rubber based adhesive. 
     
     
       31. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in  claim 28  wherein the seamless polishing pad is generated by pouring a polymeric gel into a mold. 
     
     
       32. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in  claim 28  wherein the seamless polishing pad is a polymeric material. 
     
     
       33. A method for generating a polishing pad structure for utilization in chemical mechanical polishing as recited in  claim 28  wherein the curing includes heating the polishing pad structure. 
     
     
       34. A method for generating a polishing pad structure for utilization in chemical mechanical polishing, comprising: 
       providing a reinforcement layer;  
       applying a first adhesive film on the reinforcement layer;  
       attaching a cushioning layer on the first adhesive film;  
       applying a second adhesive film on the cushioning layer;  
       attaching a seamless polymeric polishing pad on the second adhesive layer, the polymeric polishing pad having a grooved top surface; and  
       curing the polishing pad structure between about 12 hours to about 48 hours at a temperature of between about 150 F to 300 F.  
     
     
       35. A method for generating a polishing pad structure for utilization in chemical mechanical polishing, comprising: 
       providing a reinforcement layer;  
       applying a first adhesive film on the reinforcement layer;  
       attaching a cushioning layer on the first adhesive film;  
       applying a second adhesive film on the cushioning layer;  
       attaching a seamless polymeric polishing pad on the second adhesive layer, the polymeric polishing pad having a grooved top surface, the seamless polishing pad being generated by pouring a polymeric gel into a mold; and  
       curing the polishing pad structure for about 20 hours in a temperature of about 200 F.