Inventor
LU CHIH WEI
TW140 patents
⚠️ This page may combine multiple inventors who share the name “LU CHIH WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
41 patentsUS9633999B1Apr 25, 2017
Method and structure for semiconductor mid-end-of-line (MEOL) process
TAIWAN SEMICONDUCTOR MFG CO LTD32 citations94
US10937652B1Mar 2, 2021
Method and structure of cut end with self-aligned double patterning
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations86
US11251118B2Feb 15, 2022
Self-aligned via structures with barrier layers
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10818600B2Oct 27, 2020
Structure and method for a low-k dielectric with pillar-type air-gaps
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10636963B2Apr 28, 2020
Magnetic tunnel junctions
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10355198B2Jul 16, 2019
Memory device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10270028B1Apr 23, 2019
Memory device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10163887B2Dec 25, 2018
Method and structure for semiconductor mid-end-of-line (MEOL) process
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9633949B2Apr 25, 2017
Copper etching integration scheme
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9373586B2Jun 21, 2016
Copper etching integration scheme
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US12424488B2Sep 23, 2025
Dual etch-stop layer structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75
US12046551B2Jul 23, 2024
Interconnect structure having a barrier layer along the sidewall of self-aligned via structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11942364B2Mar 26, 2024
Selective deposition of a protective layer to reduce interconnect structure critical dimensions
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11848207B2Dec 19, 2023
Method and structure of cut end with self-aligned double patterning
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11798910B2Oct 24, 2023
Self-aligned interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11631639B2Apr 18, 2023
Method of fabricating self-aligned via structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11521970B2Dec 6, 2022
Semiconductor device and a method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11521896B2Dec 6, 2022
Selective deposition of a protective layer to reduce interconnect structure critical dimensions
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11362030B2Jun 14, 2022
Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11302641B2Apr 12, 2022
Self-aligned cavity strucutre
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11183422B2Nov 23, 2021
Semiconductor structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11171284B2Nov 9, 2021
Memory device
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11171052B2Nov 9, 2021
Methods of forming interconnect structures with selectively deposited pillars and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11158518B2Oct 26, 2021
Methods of etching metals in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10985312B2Apr 20, 2021
Methods of fabricating magneto-resistive random-access memory (MRAM) devices with self-aligned top electrode via and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10854458B2Dec 1, 2020
Method and structure for semiconductor device having gate spacer protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10741417B2Aug 11, 2020
Method for forming interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10700264B2Jun 30, 2020
Memory device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10515945B2Dec 24, 2019
Method and structure for semiconductor mid-end-of-year (MEOL) process
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10461246B2Oct 29, 2019
Memory device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10340181B2Jul 2, 2019
Interconnect structure including air gap
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10290536B2May 14, 2019
Structure and method for interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10068770B2Sep 4, 2018
Method and structure for semiconductor device having gate spacer protection layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10020259B2Jul 10, 2018
Copper etching integration scheme
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9947646B2Apr 17, 2018
Method and structure for semiconductor mid-end-of-line (MEOL) process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9721887B2Aug 1, 2017
Method of forming metal interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9698100B2Jul 4, 2017
Structure and method for interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9893062B2Feb 13, 2018
Semiconductor device and a method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12464954B2Nov 4, 2025
Magneto-resistive random-access memory (MRAM) devices with self-aligned top electrode via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12368046B2Jul 22, 2025
Method and structure of cut end with self-aligned double patterning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12354881B2Jul 8, 2025
Methods of etching metals in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
TAIWAN SEMICONDUCTOR MFG
2 patentsMICROBASE TECHNOLOGY CORP
2 patentsUNIMICRON TECHNOLOGY CORP
1 patentTAIWAN SEMINCONDUCTOR MFG COMPANY LTD
1 patentLU CHIH WEI
1 patentWU CHUN-LIANG
1 patentYU PO-CHIN
1 patentShowing the top 50 of 140 patents by PatentIndex Score.