Inventor

LI BAOZHEN

US161 patents

⚠️ This page may combine multiple inventors who share the name “LI BAOZHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI BAOZHEN

IBM

Structure and method for monitoring stress-induced degradation of conductive interconnects

Interconnect with recessed dielectric adjacent a noble metal cap

Liner with improved electromigration redundancy for damascene interconnects

MIM capacitor for improved process defect tolerance

Advanced crack stop structure

Advanced crack stop structure

Semiconductor via structure with lower electrical resistance

Optimized wires for resistance or electromigration

Electromigration test structure for Cu barrier integrity and blech effect evaluations

Structure and process for W contacts

Semiconductor device reliability model and methodologies for use thereof

Interconnect structure with an electromigration and stress migration enhancement liner

3D via capacitor with a floating conductive plate for improved reliability

Interconnect structure

Reliable resistive random access memory

Switchable metal insulator metal capacitor

Long channel and short channel vertical FET co-integration for vertical FET VTFET

On integrated circuit (IC) device simultaneously formed capacitor and resistor

Contacts having a geometry to reduce resistance

Low resistance high capacitance density MIM capacitor

Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device

BEOL electrical fuse and method of forming the same

Collar formation for chamfer-less and chamfered vias

Integrated circuit chip reliability qualification using a sample-specific expected fail rate

Low resistance contact for transistors

Semiconductor via structure with lower electrical resistance

Electrical fuse with metal line migration

Reliability-optimized selective voltage binning

Dual damascene structure with liner

Determining appropriateness of sampling integrated circuit test data in the presence of manufacturing variations

Semiconductor device reliability model and methodologies for use thereof

Via bottom contact and method of manufacturing same

Structure and programming of laser fuse

E-fuse co-processed with MIM capacitor

Three plate MIM capacitor via integrity verification

Dielectric reliability assessment for advanced semiconductors

Programmable electrical fuse

Isolation rail between backside power rails

Contacts having a geometry to reduce resistance

Bottom conductive structure with a limited top contact area

YANG CHIH-CHAO

3D via capacitor with a floating conductive plate for improved reliability

Interconnect structure with an electromigration and stress migration enhancement liner

Electrical fuse and method of making the same

LI BAOZHEN

Electrically programmable metal fuse

Electromigration resistant via-to-line interconnect

SIEMENS WESTINGHOUSE POWER

Lanthanum manganite-based air electrode for solid oxide fuel cells

BURKE CHAD M

Method to improve fine Cu line reliability in an integrated circuit device

GLOBALFOUNDRIES INC

Integrated circuit chip reliability using reliability-optimized failure mechanism targeting

BICKFORD JEANNE P

Method and system to predict a number of electromigration critical elements

BARWIN JOHN E

Integrated circuit design method and system