Inventor

O'SULLIVAN EUGENE J

US110 patents

⚠️ This page may combine multiple inventors who share the name “O'SULLIVAN EUGENE J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

O'SULLIVAN EUGENE J

IBM

Method of forming barrier layers for damascene interconnects

Dual etch stop/diffusion barrier for damascene interconnects

Electroless plating of metallic features on nonmetallic or semiconductor layer without extraneous plating

Corrosion protection for metallic features

Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition

Process for fabricating improved multilayer interconnect systems

High resistivity soft magnetic material for miniaturized power converter

Structure and method to reduce shorting and process degradation in STT-MRAM devices

Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped

Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped

Electroless metal adhesion to organic dielectric material with phase separated morphology

Method for fabricating a magnetic material stack

Structure and method to reduce shorting and process degradation in STT-MRAM devices

Forming self-aligned contacts on pillar structures

Magnetic inductor stacks with multilayer isolation layers

High resistivity iron-based, thermally stable magnetic material for on-chip integrated inductors

Magnetic multilayer structure

High resistivity iron-based, thermally stable magnetic material for on-chip integrated inductors

Planar inductors with closed magnetic loops

Low degradation MRAM encapsulation process using silicon-rich silicon nitride film

Techniques for forming contacts for active BEOL

Structure and method for formation of cladded interconnects for MRAMs

Hard mask structure for patterning of materials

Hard mask structure for patterning of materials

Selective chemical etch method for MRAM soft layers

Multilayer interconnect systems

Biosensor electrode having three-dimensional structured sensing surfaces

Short circuit reduction in magnetic tunnel junctions

Stress control in magnetic inductor stacks

Combined CMP and RIE contact scheme for MRAM applications

Method of fabricating a laminated stack of magnetic inductor

Magnetic inductor stack including magnetic materials having multiple permeabilities

Magnetic inductor stacks

Magnetic inductor stack including magnetic materials having multiple permeabilities

Stress management scheme for fabricating thick magnetic films of an inductor yoke arrangement

Structure and method to reduce shorting and process degradation in stt-MRAM devices

Combined CMP and RIE contact scheme for MRAM applications

Structure and method to reduce shorting and process degradation in STT-MRAM devices

Patterning magnetic films using self-stop electro-etching

Forming magnetic microelectromechanical inductive components

Electroless plating of cobalt alloys for on chip inductors

Method of forming an on-pitch self-aligned hard mask for contact to a tunnel junction using ion beam etching

Electronic devices having metallurgies containing copper-semiconductor compounds

High Tc superconductor - gallate crystal structures

Micro-electromechanical device having a soft magnetic material electrolessly deposited on a palladium layer coated metal beam

FONTANA JR ROBERT E

Inductor with laminated yoke

Inductor with stacked conductors

ASSEFA SOLOMON

Pillar-based interconnects for magnetoresistive random access memory

Pillar-based interconnects for magnetoresistive random access memory

BABICH KATHERINA E

Filling narrow openings using ion beam etch