Inventor
BEAMAN KEVIN L
US34 patents
⚠️ This page may combine multiple inventors who share the name “BEAMAN KEVIN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
31 patentsUS7422635B2Sep 9, 2008
Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
MICRON TECHNOLOGY INC483 citations99
US7514366B2Apr 7, 2009
Methods for forming shallow trench isolation
MICRON TECHNOLOGY INC42 citations96
US6686298B1Feb 3, 2004
Methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates
MICRON TECHNOLOGY INC31 citations96
US6437375B1Aug 20, 2002
PD-SOI substrate with suppressed floating body effect and method for its fabrication
MICRON TECHNOLOGY INC77 citations96
US6429070B1Aug 6, 2002
DRAM cell constructions, and methods of forming DRAM cells
MICRON TECHNOLOGY INC37 citations96
US6690046B2Feb 10, 2004
Semiconductor assemblies, methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates
MICRON TECHNOLOGY INC24 citations93
US7647886B2Jan 19, 2010
Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers
MICRON TECHNOLOGY INC45 citations92
US7271464B2Sep 18, 2007
Liner for shallow trench isolation
MICRON TECHNOLOGY INC15 citations92
US7056806B2Jun 6, 2006
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
MICRON TECHNOLOGY INC23 citations92
US6746937B2Jun 8, 2004
PD-SOI substrate with suppressed floating body effect and method for its fabrication
MICRON TECHNOLOGY INC32 citations92
US6734062B2May 11, 2004
Methods of forming DRAM cells
MICRON TECHNOLOGY INC16 citations92
US6723599B2Apr 20, 2004
Methods of forming capacitors and methods of forming capacitor dielectric layers
MICRON TECHNOLOGY INC22 citations91
US7919829B2Apr 5, 2011
Liner for shallow trench isolation
MICRON TECHNOLOGY INC9 citations84
US7906393B2Mar 15, 2011
Methods for forming small-scale capacitor structures
MICRON TECHNOLOGY INC8 citations84
US7344755B2Mar 18, 2008
Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
MICRON TECHNOLOGY INC10 citations84
US7258892B2Aug 21, 2007
Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
MICRON TECHNOLOGY INC13 citations84
US7235138B2Jun 26, 2007
Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
MICRON TECHNOLOGY INC14 citations84
US7771537B2Aug 10, 2010
Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition
MICRON TECHNOLOGY INC5 citations74
US7399714B2Jul 15, 2008
Method of forming a structure over a semiconductor substrate
MICRON TECHNOLOGY INC3 citations74
US7371647B2May 13, 2008
Methods of forming transistors
MICRON TECHNOLOGY INC5 citations74
US7279398B2Oct 9, 2007
Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
MICRON TECHNOLOGY INC6 citations74
US7153736B2Dec 26, 2006
Methods of forming capacitors and methods of forming capacitor dielectric layers
MICRON TECHNOLOGY INC10 citations72
US8384192B2Feb 26, 2013
Methods for forming small-scale capacitor structures
MICRON TECHNOLOGY INC2 citations63
US7651910B2Jan 26, 2010
Methods of forming programmable memory devices
MICRON TECHNOLOGY INC5 citations63
US6617262B2Sep 9, 2003
Sputtered insulating layer for wordline stacks
MICRON TECHNOLOGY INC2 citations63
US6589843B1Jul 8, 2003
Methods of forming FLASH field effect transistor gates and non-FLASH field effect transistor gates
MICRON TECHNOLOGY INC3 citations63
US6455441B1Sep 24, 2002
Sputtered insulating layer for wordline stacks
MICRON TECHNOLOGY INC2 citations63
US6707090B2Mar 16, 2004
DRAM cell constructions
MICRON TECHNOLOGY INC3 citations62
US6639243B2Oct 28, 2003
DRAM cell constructions
MICRON TECHNOLOGY INC3 citations62
US8030170B2Oct 4, 2011
Methods of forming isolation structures, and methods of forming nonvolatile memory
MICRON TECHNOLOGY INC2 citations53
US6815372B2Nov 9, 2004
Sputtered insulating layer for wordline stacks
MICRON TECHNOLOGY INC0 citations52