P

Inventor

BEAMAN KEVIN L

US34 patents
⚠️ This page may combine multiple inventors who share the name “BEAMAN KEVIN L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

31 patents
US7422635B2Sep 9, 2008

Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces

MICRON TECHNOLOGY INC483 citations99
US7514366B2Apr 7, 2009

Methods for forming shallow trench isolation

MICRON TECHNOLOGY INC42 citations96
US6686298B1Feb 3, 2004

Methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates

MICRON TECHNOLOGY INC31 citations96
US6437375B1Aug 20, 2002

PD-SOI substrate with suppressed floating body effect and method for its fabrication

MICRON TECHNOLOGY INC77 citations96
US6429070B1Aug 6, 2002

DRAM cell constructions, and methods of forming DRAM cells

MICRON TECHNOLOGY INC37 citations96
US6690046B2Feb 10, 2004

Semiconductor assemblies, methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates

MICRON TECHNOLOGY INC24 citations93
US7647886B2Jan 19, 2010

Systems for depositing material onto workpieces in reaction chambers and methods for removing byproducts from reaction chambers

MICRON TECHNOLOGY INC45 citations92
US7271464B2Sep 18, 2007

Liner for shallow trench isolation

MICRON TECHNOLOGY INC15 citations92
US7056806B2Jun 6, 2006

Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces

MICRON TECHNOLOGY INC23 citations92
US6746937B2Jun 8, 2004

PD-SOI substrate with suppressed floating body effect and method for its fabrication

MICRON TECHNOLOGY INC32 citations92
US6734062B2May 11, 2004

Methods of forming DRAM cells

MICRON TECHNOLOGY INC16 citations92
US6723599B2Apr 20, 2004

Methods of forming capacitors and methods of forming capacitor dielectric layers

MICRON TECHNOLOGY INC22 citations91
US7919829B2Apr 5, 2011

Liner for shallow trench isolation

MICRON TECHNOLOGY INC9 citations84
US7906393B2Mar 15, 2011

Methods for forming small-scale capacitor structures

MICRON TECHNOLOGY INC8 citations84
US7344755B2Mar 18, 2008

Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers

MICRON TECHNOLOGY INC10 citations84
US7258892B2Aug 21, 2007

Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition

MICRON TECHNOLOGY INC13 citations84
US7235138B2Jun 26, 2007

Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces

MICRON TECHNOLOGY INC14 citations84
US7771537B2Aug 10, 2010

Methods and systems for controlling temperature during microfeature workpiece processing, E.G. CVD deposition

MICRON TECHNOLOGY INC5 citations74
US7399714B2Jul 15, 2008

Method of forming a structure over a semiconductor substrate

MICRON TECHNOLOGY INC3 citations74
US7371647B2May 13, 2008

Methods of forming transistors

MICRON TECHNOLOGY INC5 citations74
US7279398B2Oct 9, 2007

Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces

MICRON TECHNOLOGY INC6 citations74
US7153736B2Dec 26, 2006

Methods of forming capacitors and methods of forming capacitor dielectric layers

MICRON TECHNOLOGY INC10 citations72
US8384192B2Feb 26, 2013

Methods for forming small-scale capacitor structures

MICRON TECHNOLOGY INC2 citations63
US7651910B2Jan 26, 2010

Methods of forming programmable memory devices

MICRON TECHNOLOGY INC5 citations63
US6617262B2Sep 9, 2003

Sputtered insulating layer for wordline stacks

MICRON TECHNOLOGY INC2 citations63
US6589843B1Jul 8, 2003

Methods of forming FLASH field effect transistor gates and non-FLASH field effect transistor gates

MICRON TECHNOLOGY INC3 citations63
US6455441B1Sep 24, 2002

Sputtered insulating layer for wordline stacks

MICRON TECHNOLOGY INC2 citations63
US6707090B2Mar 16, 2004

DRAM cell constructions

MICRON TECHNOLOGY INC3 citations62
US6639243B2Oct 28, 2003

DRAM cell constructions

MICRON TECHNOLOGY INC3 citations62
US8030170B2Oct 4, 2011

Methods of forming isolation structures, and methods of forming nonvolatile memory

MICRON TECHNOLOGY INC2 citations53
US6815372B2Nov 9, 2004

Sputtered insulating layer for wordline stacks

MICRON TECHNOLOGY INC0 citations52

ROUND ROCK RES LLC

2 patents

BEAMAN KEVIN L

1 patent