Inventor
KANG TAEWOO
KR22 patents
⚠️ This page may combine multiple inventors who share the name “KANG TAEWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
8 patentsUS7615865B2Nov 10, 2009
Standoff height improvement for bumping technology using solder resist
STATS CHIPPAC LTD8 citations82
USRE44608ENov 26, 2013
Solder joint flip chip interconnection
STATS CHIPPAC LTD3 citations62
US7951643B2May 31, 2011
Integrated circuit packaging system with lead frame and method of manufacture thereof
STATS CHIPPAC LTD4 citations62
US8018052B2Sep 13, 2011
Integrated circuit package system with side substrate having a top layer
STATS CHIPPAC LTD4 citations61
US9373573B2Jun 21, 2016
Solder joint flip chip interconnection
STATS CHIPPAC LTD0 citations52
USRE44761EFeb 11, 2014
Solder joint flip chip interconnection having relief structure
STATS CHIPPAC LTD0 citations52
US7659633B2Feb 9, 2010
Solder joint flip chip interconnection having relief structure
STATS CHIPPAC LTD0 citations52
US7875495B2Jan 25, 2011
Standoff height improvement for bumping technology using solder resist
STATS CHIPPAC LTD1 citations50
PENDSE RAJENDRA D
5 patentsUS8129841B2Mar 6, 2012
Solder joint flip chip interconnection
PENDSE RAJENDRA D29 citations92
US9773685B2Sep 26, 2017
Solder joint flip chip interconnection having relief structure
PENDSE RAJENDRA D6 citations84
US8810029B2Aug 19, 2014
Solder joint flip chip interconnection
PENDSE RAJENDRA D8 citations84
USRE44562EOct 29, 2013
Solder joint flip chip interconnection having relief structure
PENDSE RAJENDRA D3 citations62
US8216930B2Jul 10, 2012
Solder joint flip chip interconnection having relief structure
PENDSE RAJENDRA D3 citations62