Inventor

PARK SANG-SICK

KR24 patents

⚠️ This page may combine multiple inventors who share the name “PARK SANG-SICK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK SANG-SICK

SAMSUNG ELECTRONICS CO LTD

Semiconductor package having a high reliability

Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages

Semiconductor package having recessed adhesive layer between stacked chips

Semiconductor package having a high reliability

Semiconductor package including a fillet layer

Semiconductor package having a high reliability

Semiconductor package having a high reliability

Semiconductor package having a high reliability

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor package having a high reliability

Semiconductor package including a fillet layer

Semiconductor packages

Semiconductor device and method of fabricating the same

Bi-directional camera module and flip chip bonder including the same

Method of manufacturing chip-stacked semiconductor package

Semiconductor package

Semiconductor package with increased thermal radiation efficiency

Semiconductor package

LEE HO-JIN

Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes

AHN JUNG-SEOK

Method of manufacturing chip-stacked semiconductor package

MA KEUM-HEE

Multi-chip package having semiconductor chips of different thicknesses from each other and related device

JEON CHANG-SEONG

Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method

PARK SANG SICK

Semiconductor packages