Inventor

BANSAL RAJ K

US18 patents

⚠️ This page may combine multiple inventors who share the name “BANSAL RAJ K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BANSAL RAJ K

MICRON TECHNOLOGY INC

Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices

Integrated circuit structures and methods of forming an opening in a material

Semiconductor assemblies with hybrid fanouts and associated methods and systems

Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methods

Semiconductor device and method of forming the same

Apparatuses and methods including patterns in scribe regions of semiconductor devices

Semiconductor device and method of forming the same

Integrated circuit structures and methods of forming an opening in a material

Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses

Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate

Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate

Bond pad connection layout

Bond pad connection layout

Techniques for forming a device with scribe asymmetry

Semiconductor assemblies with system and methods for conveying signals using through mold vias

LODESTAR LICENSING GROUP LLC

Semiconductor assemblies with hybrid fanouts and associated methods and systems

Bond pad connection layout

Semiconductor assemblies with hybrid fanouts and associated methods and systems