Inventor · disambiguated record
Ah Ron Lee
Also filed as: LEE AH RON
14 granted patents·1 pending application·21 citations·filing 2015–2024
86Inventor score
Top patents by PatentIndex Score
15 records- 0192US9565774B2Embedded trace substrate and method of forming the sameAMKOR TECHNOLOGY INC·Filed 2015·Granted Feb 7, 2017·13 cites·9 claims
- 0280US9972590B2Semiconductor package having a solder-on-pad structureAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·4 cites·20 claims
- 0372US12489042B2Device having solder bump structure for improved mechanical, electrical, and/or thermal performanceAVAGO TECH INT SALES PTE LID·Filed 2024·Granted Dec 2, 2025·0 cites·19 claims
- 0470US10134686B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2017·Granted Nov 20, 2018·1 cites·21 claims
- 0568US10285258B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2018·Granted May 7, 2019·1 cites·20 claims
- 0666US10264666B2Method of providing compartment EMI shields on printed circuit board using a vacuumAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Apr 16, 2019·1 cites·20 claims
- 0762US12002741B2Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengthsAVAGO TECH INT SALES PTE LID·Filed 2021·Granted Jun 4, 2024·0 cites·11 claims
- 0859US10468356B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Nov 5, 2019·0 cites·20 claims
- 0959US9974181B2Module with external shield and back-spill barrier for protecting contact padsAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·1 cites·20 claims
- 1057US10477673B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Nov 12, 2019·0 cites·21 claims
- 1157US10229888B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2018·Granted Mar 12, 2019·0 cites·19 claims
- 1247US11610738B2Low profile passive components and devices and packages including the sameAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Mar 21, 2023·0 cites·20 claims
- 1341US2020043821A1Electronic assembly and a method of forming thereofAVAGO TECH INT SALES PTE LID·Filed 2018·Application pending·0 cites
- 1440US10178757B2Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packagesAVAGO TECHNOLOGIES GENERAL IP·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 1539US9972592B2Bumped land grid arrayAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →