Inventor

WU CHI-HSI

TW182 patents

⚠️ This page may combine multiple inventors who share the name “WU CHI-HSI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU CHI-HSI

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structures and methods of forming the same

Semiconductor package and method of forming the same

Dummy features in redistribution layers (RDLS) and methods of forming same

Structure and formation method for chip package

Integrated circuit package pad and methods of forming

Chip package having die structures of different heights and method of forming same

Semiconductor package and method of forming the same

Redistribution layers in semiconductor packages and methods of forming same

Photonic semiconductor device and method of manufacture

Interconnect chips

Package structures and methods of forming the same

Interconnect chips

Package structures and methods of forming the same

3DIC packaging with hot spot thermal management features

Devices employing thermal and mechanical enhanced layers and methods of forming same

Chip package having die structures of different heights

Packages with thermal interface material on the sidewalls of stacked dies

Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devices

Dummy metal with zigzagged edges

FinFET device

3DIC packaging with hot spot thermal management features

Method of making a FinFET device

Photonic semiconductor device and method of manufacture

Integrated circuit package pad and methods of forming

Redistribution layers in semiconductor packages and methods of forming same

Package structures and methods of forming the same

Package with bridge die for interconnection and method forming same

Giga interposer integration through chip-on-wafer-on-substrate

Photonic semiconductor device and method

Semiconductor structure

Optical transceiver and manufacturing method thereof

Devices employing thermal and mechanical enhanced layers and methods of forming same

Package structures and methods of forming the same

Package structure and manufacturing method thereof

Method of fabricating a FinFET device

Semiconductor device and method for manufacturing the same

Semiconductor structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Redistribution layers in semiconductor packages and methods of forming same

Multi-stacked package-on-package structures

Packaging with substrates connected by conductive bumps

Integrated circuit package pad and methods of forming

TAIWAN SEMICONDUCTOR MFG

Methods of forming integrated circuit package

Method of fabricating an electrical fuse for silicon-on-insulator devices

Metal fuse for semiconductor devices

Metal-insulator-metal device structure inserted into a low k material and the method for making same

SHEN CHUN-LIANG

FinFET with high mobility and strain channel

YIN JOANNA CHAW YANE

Method of making a FinFET device

WINBOND ELECTRONICS CORP

Method for preventing alignment marks from disappearing after chemical mechanical polishing