Inventor
TIAN SHURONG
US39 patents
⚠️ This page may combine multiple inventors who share the name “TIAN SHURONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
35 patentsUS8004841B2Aug 23, 2011
Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
IBM66 citations98
US7342789B2Mar 11, 2008
Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling
IBM130 citations98
US7486513B2Feb 3, 2009
Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid cooling
IBM71 citations97
US10215504B2Feb 26, 2019
Flexible cold plate with enhanced flexibility
IBM25 citations94
US7715197B2May 11, 2010
Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
IBM22 citations93
US7474529B2Jan 6, 2009
Folded-sheet-metal heatsinks for closely packaged heat-producing devices
IBM27 citations92
US11058030B2Jul 6, 2021
Cold plate with flex regions between fin areas
IBM12 citations86
US10712102B2Jul 14, 2020
Injection-molded flexible cold plate
IBM15 citations86
US10631438B2Apr 21, 2020
Mechanically flexible cold plates for low power components
IBM10 citations84
US10568236B2Feb 18, 2020
Space-efficient pressure relief mechanism for immersion cooling of computing elements
IBM8 citations84
US10222125B2Mar 5, 2019
Burst resistant thin wall heat sink
IBM6 citations84
US9634959B2Apr 25, 2017
High-density, fail-in-place switches for computer and data networks
IBM6 citations84
US9570373B1Feb 14, 2017
Near-chip compliant layer for reducing perimeter stress during assembly process
IBM10 citations84
US9894801B1Feb 13, 2018
Cold plate
IBM8 citations80
US11497143B2Nov 8, 2022
Mechanically flexible cold plates for low power components
IBM2 citations73
US11243034B2Feb 8, 2022
Injection-molded flexible cold plate
IBM2 citations73
US11350544B2May 31, 2022
Flexible cold plate with parallel fluid flow paths
IBM3 citations72
US9213378B2Dec 15, 2015
Cooling system for electronic components
IBM5 citations72
US11131506B2Sep 28, 2021
Burst resistant thin wall heat sink
IBM0 citations63
US11792911B2Oct 17, 2023
Flexible cold plate for contacting varied and variable chip heights
IBM0 citations62
US11621212B2Apr 4, 2023
Backing plate with manufactured features on top surface
IBM0 citations62
US11056413B2Jul 6, 2021
Combined inductor and heat transfer device
IBM0 citations62
US10231356B2Mar 12, 2019
Cold plate
IBM1 citations62
US10531598B2Jan 7, 2020
Fans in series with cable plug interfaces
IBM1 citations61
US12262514B2Mar 25, 2025
Heat sinks with beyond-board fins
IBM0 citations52
US12230436B2Feb 18, 2025
Spacer to reduce magnetic coupling
IBM0 citations52
US10779436B2Sep 15, 2020
Space-efficient pressure relief mechanism for immersion cooling of computing elements
IBM0 citations52
US10749817B2Aug 18, 2020
High-density, fail-in-place switches for computer and data networks
IBM0 citations52
US10389654B2Aug 20, 2019
High-density, fail-in-place switches for computer and data networks
IBM0 citations52
US9922900B2Mar 20, 2018
Near-chip compliant layer for reducing perimeter stress during assembly process
IBM0 citations52
US9678289B1Jun 13, 2017
Thermal management of optical coupling systems
IBM1 citations52
US11792954B2Oct 17, 2023
Dedicated airflow channels for cooling server drawers
IBM0 citations51
US11631635B2Apr 18, 2023
Flex prevention mechanical structure such as a ring for large integrated circuit modules and packages and methods of manufacture using same
IBM0 citations51
US11439043B2Sep 6, 2022
Multi-device cooling structure having assembly alignment features
IBM0 citations45
US9831783B2Nov 28, 2017
Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense
IBM0 citations42