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Inventor

MARION FRANCOIS

FR38 patents
⚠️ This page may combine multiple inventors who share the name “MARION FRANCOIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

COMMISSARIAT ENERGIE ATOMIQUE

27 patents
US6566170B1May 20, 2003

Method for forming a device having a cavity with controlled atmosphere

COMMISSARIAT ENERGIE ATOMIQUE49 citations92
US6151173ANov 21, 2000

Assembly of optical components optically aligned and method for making this assembly

COMMISSARIAT ENERGIE ATOMIQUE38 citations90
US6942396B2Sep 13, 2005

Method and device for the passive alignment of optical fibers and optoelectronic components

COMMISSARIAT ENERGIE ATOMIQUE24 citations89
US6170155B1Jan 9, 2001

System of components to be hybridized and hybridization process allowing for thermal expansions

COMMISSARIAT ENERGIE ATOMIQUE25 citations86
US6639928B2Oct 28, 2003

Optic device comprising a plurality of resonant cavities of different lengths associated with different wavelengths

COMMISSARIAT ENERGIE ATOMIQUE13 citations84
US7031578B2Apr 18, 2006

Method and device for passive alignment of optical waveguides and optoelectronic components and optical system using said device

COMMISSARIAT ENERGIE ATOMIQUE11 citations83
US5119240AJun 2, 1992

Assembly of parts forming an angle between them and process for obtaining said assembly

COMMISSARIAT ENERGIE ATOMIQUE20 citations78
US6281039B1Aug 28, 2001

Hybrid device and a method of producing electrically active components by an assembly operation

COMMISSARIAT ENERGIE ATOMIQUE12 citations74
US6166368ADec 26, 2000

Photodetection device, process for the production of this device and application to multispectral detection

COMMISSARIAT ENERGIE ATOMIQUE7 citations72
US5496769AMar 5, 1996

Process for coating electronic components hybridized by bumps on a substrate

COMMISSARIAT ENERGIE ATOMIQUE18 citations71
US5131584AJul 21, 1992

Method to interconnect electric components by means of solder elements

COMMISSARIAT ENERGIE ATOMIQUE11 citations71
US7938311B2May 10, 2011

Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method

COMMISSARIAT ENERGIE ATOMIQUE4 citations63
US5107078AApr 21, 1992

Electric connection or disconnection element, integrated circuit including such elements and the corresponding connection or disconnection method

COMMISSARIAT ENERGIE ATOMIQUE4 citations62
US5602385AFeb 11, 1997

Two wave band radiation detector having two facing photodetectors and method for making same

COMMISSARIAT ENERGIE ATOMIQUE5 citations60
US7717718B2May 18, 2010

Electric component having microtips and ductile conducting bumps

COMMISSARIAT ENERGIE ATOMIQUE6 citations58
US5968389AOct 19, 1999

Method and machine for hybridization by refusion

COMMISSARIAT ENERGIE ATOMIQUE6 citations56
US7772041B2Aug 10, 2010

Method of sealing or welding two elements to one another

COMMISSARIAT ENERGIE ATOMIQUE1 citations52
US7569940B2Aug 4, 2009

Method and device for connecting chips

COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US6741787B2May 25, 2004

Process and device for connection/disconnection of an optical fiber with an optoelectronic component

COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US9793141B2Oct 17, 2017

Hybrid electronic device protected against humidity and method of protecting a hybrid electronic device against humidity

COMMISSARIAT ENERGIE ATOMIQUE0 citations51
US7691735B2Apr 6, 2010

Method for manufacturing metal chips by plasma from a layer comprising several elements

COMMISSARIAT ENERGIE ATOMIQUE0 citations50
US6399895B1Jun 4, 2002

Component hybridizing system allowing for defective planarity

COMMISSARIAT ENERGIE ATOMIQUE1 citations49
US7759261B2Jul 20, 2010

Method for producing layers located on a hybrid circuit

COMMISSARIAT ENERGIE ATOMIQUE0 citations48
US7645686B2Jan 12, 2010

Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit

COMMISSARIAT ENERGIE ATOMIQUE1 citations48
US9166338B2Oct 20, 2015

Connecting elements for producing hybrid electronic circuits

COMMISSARIAT ENERGIE ATOMIQUE0 citations44
US9368473B2Jun 14, 2016

Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method

COMMISSARIAT ENERGIE ATOMIQUE0 citations42
US7524704B2Apr 28, 2009

Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam

COMMISSARIAT ENERGIE ATOMIQUE0 citations42

MARION FRANCOIS

10 patents

FENDLER MANUEL

1 patent