Inventor
MARION FRANCOIS
FR38 patents
⚠️ This page may combine multiple inventors who share the name “MARION FRANCOIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMMISSARIAT ENERGIE ATOMIQUE
27 patentsUS6566170B1May 20, 2003
Method for forming a device having a cavity with controlled atmosphere
COMMISSARIAT ENERGIE ATOMIQUE49 citations92
US6151173ANov 21, 2000
Assembly of optical components optically aligned and method for making this assembly
COMMISSARIAT ENERGIE ATOMIQUE38 citations90
US6942396B2Sep 13, 2005
Method and device for the passive alignment of optical fibers and optoelectronic components
COMMISSARIAT ENERGIE ATOMIQUE24 citations89
US6170155B1Jan 9, 2001
System of components to be hybridized and hybridization process allowing for thermal expansions
COMMISSARIAT ENERGIE ATOMIQUE25 citations86
US6639928B2Oct 28, 2003
Optic device comprising a plurality of resonant cavities of different lengths associated with different wavelengths
COMMISSARIAT ENERGIE ATOMIQUE13 citations84
US7031578B2Apr 18, 2006
Method and device for passive alignment of optical waveguides and optoelectronic components and optical system using said device
COMMISSARIAT ENERGIE ATOMIQUE11 citations83
US5119240AJun 2, 1992
Assembly of parts forming an angle between them and process for obtaining said assembly
COMMISSARIAT ENERGIE ATOMIQUE20 citations78
US6281039B1Aug 28, 2001
Hybrid device and a method of producing electrically active components by an assembly operation
COMMISSARIAT ENERGIE ATOMIQUE12 citations74
US6166368ADec 26, 2000
Photodetection device, process for the production of this device and application to multispectral detection
COMMISSARIAT ENERGIE ATOMIQUE7 citations72
US5496769AMar 5, 1996
Process for coating electronic components hybridized by bumps on a substrate
COMMISSARIAT ENERGIE ATOMIQUE18 citations71
US5131584AJul 21, 1992
Method to interconnect electric components by means of solder elements
COMMISSARIAT ENERGIE ATOMIQUE11 citations71
US7938311B2May 10, 2011
Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
COMMISSARIAT ENERGIE ATOMIQUE4 citations63
US5107078AApr 21, 1992
Electric connection or disconnection element, integrated circuit including such elements and the corresponding connection or disconnection method
COMMISSARIAT ENERGIE ATOMIQUE4 citations62
US5602385AFeb 11, 1997
Two wave band radiation detector having two facing photodetectors and method for making same
COMMISSARIAT ENERGIE ATOMIQUE5 citations60
US7717718B2May 18, 2010
Electric component having microtips and ductile conducting bumps
COMMISSARIAT ENERGIE ATOMIQUE6 citations58
US5968389AOct 19, 1999
Method and machine for hybridization by refusion
COMMISSARIAT ENERGIE ATOMIQUE6 citations56
US7772041B2Aug 10, 2010
Method of sealing or welding two elements to one another
COMMISSARIAT ENERGIE ATOMIQUE1 citations52
US7569940B2Aug 4, 2009
Method and device for connecting chips
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US6741787B2May 25, 2004
Process and device for connection/disconnection of an optical fiber with an optoelectronic component
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US9793141B2Oct 17, 2017
Hybrid electronic device protected against humidity and method of protecting a hybrid electronic device against humidity
COMMISSARIAT ENERGIE ATOMIQUE0 citations51
US7691735B2Apr 6, 2010
Method for manufacturing metal chips by plasma from a layer comprising several elements
COMMISSARIAT ENERGIE ATOMIQUE0 citations50
US6399895B1Jun 4, 2002
Component hybridizing system allowing for defective planarity
COMMISSARIAT ENERGIE ATOMIQUE1 citations49
US7759261B2Jul 20, 2010
Method for producing layers located on a hybrid circuit
COMMISSARIAT ENERGIE ATOMIQUE0 citations48
US7645686B2Jan 12, 2010
Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit
COMMISSARIAT ENERGIE ATOMIQUE1 citations48
US9166338B2Oct 20, 2015
Connecting elements for producing hybrid electronic circuits
COMMISSARIAT ENERGIE ATOMIQUE0 citations44
US9368473B2Jun 14, 2016
Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method
COMMISSARIAT ENERGIE ATOMIQUE0 citations42
US7524704B2Apr 28, 2009
Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam
COMMISSARIAT ENERGIE ATOMIQUE0 citations42
MARION FRANCOIS
10 patentsUS8093728B2Jan 10, 2012
Connection by fitting together two soldered inserts
MARION FRANCOIS8 citations83
US8898896B2Dec 2, 2014
Method of making a connection component with hollow inserts
MARION FRANCOIS4 citations71
US8291586B2Oct 23, 2012
Method for bonding two electronic components
MARION FRANCOIS2 citations62
US8272556B2Sep 25, 2012
Metal lip seal and machine fitted with same seal
MARION FRANCOIS4 citations62
US8097827B2Jan 17, 2012
Method for soldering two elements together using a solder material
MARION FRANCOIS4 citations62
US8058656B2Nov 15, 2011
Method for producing a matrix of individual electronic components and matrix produced thereby
MARION FRANCOIS2 citations61
US8252363B2Aug 28, 2012
Method of thinning a block transferred to a substrate
MARION FRANCOIS0 citations51
US8168478B2May 1, 2012
Method for producing a matrix of individual electronic components and matrix produced thereby
MARION FRANCOIS0 citations51
US8329311B2Dec 11, 2012
Nanoprinted device comprising metallic patterns and method of nanoprinting metallic patterns
MARION FRANCOIS0 citations48
US8664778B2Mar 4, 2014
Method of flip-chip hybridization for the forming of tight cavities and systems obtained by such a method
MARION FRANCOIS0 citations41