Inventor
LIN CHIH-HAO
TW87 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIH-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LEXTAR ELECTRONICS CORP
13 patentsUS11588078B2Feb 21, 2023
Light emitting device and module
LEXTAR ELECTRONICS CORP4 citations74
US11961951B2Apr 16, 2024
Light emitting diode device
LEXTAR ELECTRONICS CORP2 citations72
US11949056B2Apr 2, 2024
Light emitting diode packaging structure
LEXTAR ELECTRONICS CORP2 citations71
US11552222B2Jan 10, 2023
Display device
LEXTAR ELECTRONICS CORP2 citations71
US10386629B2Aug 20, 2019
Light-enhancement device, and appliance having the same
LEXTAR ELECTRONICS CORP2 citations71
US12464879B2Nov 4, 2025
Light emitting diode device
LEXTAR ELECTRONICS CORP0 citations62
US12453225B2Oct 21, 2025
Light emitting diode packaging structure
LEXTAR ELECTRONICS CORP0 citations61
US11670749B2Jun 6, 2023
Method for manufacturing light emitting diode packaging structure
LEXTAR ELECTRONICS CORP0 citations61
US11296269B2Apr 5, 2022
Light emitting diode packaging structure and method for manufacturing the same
LEXTAR ELECTRONICS CORP0 citations61
US12494457B2Dec 9, 2025
Light-emitting diode display device and method of manufacturing the same
LEXTAR ELECTRONICS CORP0 citations60
US11373589B1Jun 28, 2022
Display with pixel devices emitting light simultaneously
LEXTAR ELECTRONICS CORP1 citations60
US12588324B2Mar 24, 2026
Package structure and forming method thereof
LEXTAR ELECTRONICS CORP0 citations51
US12094861B2Sep 17, 2024
Light emitting array structure and display
LEXTAR ELECTRONICS CORP0 citations51
WINBOND ELECTRONICS CORP
9 patentsUS9887200B2Feb 6, 2018
Dynamic random access memory
WINBOND ELECTRONICS CORP2 citations73
US11309433B2Apr 19, 2022
Non-volatile memory structure and manufacturing method thereof
WINBOND ELECTRONICS CORP3 citations72
US11729968B2Aug 15, 2023
Method for manufacturing DRAM
WINBOND ELECTRONICS CORP0 citations62
US11101272B2Aug 24, 2021
DRAM and method for manufacturing the same
WINBOND ELECTRONICS CORP1 citations62
US10741561B2Aug 11, 2020
Dynamic random access memory structure including guard ring structure
WINBOND ELECTRONICS CORP1 citations62
US10453848B2Oct 22, 2019
Dynamic random access memory structure along with guard ring structure and manufacturing method thereof
WINBOND ELECTRONICS CORP1 citations62
US11705495B2Jul 18, 2023
Memory device and method of forming the same
WINBOND ELECTRONICS CORP0 citations60
US11652004B2May 16, 2023
Methods for forming memory devices
WINBOND ELECTRONICS CORP0 citations59
US11245026B2Feb 8, 2022
Memory devices
WINBOND ELECTRONICS CORP0 citations59
TAIWAN SEMICONDUCTOR MFG CO LTD
7 patentsUS9666556B2May 30, 2017
Flip chip packaging
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11011487B2May 18, 2021
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US10700030B2Jun 30, 2020
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations70
US11088109B2Aug 10, 2021
Packages with multi-thermal interface materials and methods of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations69
US11011462B2May 18, 2021
Method for forming fuse pad and bond pad of integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011431B2May 18, 2021
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11699673B2Jul 11, 2023
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
IND TECH RES INST
4 patentsUS9540488B1Jan 10, 2017
Siloxane resin composition, and photoelectric device employing the same
IND TECH RES INST3 citations71
US12202935B2Jan 21, 2025
Resin compound and resin composition containing the same
IND TECH RES INST0 citations61
US11773222B2Oct 3, 2023
Curable composition and electronic device employing the same
IND TECH RES INST0 citations61
US12516032B2Jan 6, 2026
Epoxy compound, composition and cured product thereof
IND TECH RES INST0 citations60
LIN CHIH-HAO
3 patentsDELTA ELECTRONICS INC
3 patentsHON HAI PREC IND CO LTD
2 patentsUS9907160B2Feb 27, 2018
Printed circuit board including differential transmission lines thereon and having a conductive structure which provides immunity to common-mode noise
HON HAI PREC IND CO LTD3 citations73
US8963021B2Feb 24, 2015
Electromagnetic interference shield and electronic device using the same
HON HAI PREC IND CO LTD1 citations52
TAIWAN SEMICONDUCTOR MFG
2 patentsUS6541339B1Apr 1, 2003
Nitride deposition wafer to wafer native oxide uniformity improvement for 0.35 flash erase performance by adding thermal oxide oxidation process
TAIWAN SEMICONDUCTOR MFG8 citations69
US6461979B1Oct 8, 2002
LPCVD furnace uniformity improvement by temperature ramp down deposition system
TAIWAN SEMICONDUCTOR MFG8 citations65
NETFLIX INC
2 patentsAU OPTRONICS CORP
1 patentNOVATEK MICROELECTRONICS CORP
1 patentUNIV NAT TAIWAN
1 patentREXCHIP ELECTRONICS CORP
1 patentSUMCO CORP
1 patentShowing the top 50 of 87 patents by PatentIndex Score.