Inventor
ITO FUJIO
JP39 patents
⚠️ This page may combine multiple inventors who share the name “ITO FUJIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS TECH CORP
16 patentsUS6809405B2Oct 26, 2004
Semiconductor device and method of manufacturing the same
RENESAS TECH CORP30 citations90
US7466024B2Dec 16, 2008
Multi-chip semiconductor device package
RENESAS TECH CORP11 citations84
US7208817B2Apr 24, 2007
Semiconductor device
RENESAS TECH CORP11 citations84
US7772044B2Aug 10, 2010
Method of manufacturing a semiconductor device including plural semiconductor chips
RENESAS TECH CORP7 citations74
US7339259B2Mar 4, 2008
Semiconductor device
RENESAS TECH CORP7 citations74
US7335529B2Feb 26, 2008
Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
RENESAS TECH CORP8 citations74
US6780679B2Aug 24, 2004
Semiconductor device and method of manufacturing the same
RENESAS TECH CORP11 citations74
US6803258B2Oct 12, 2004
Semiconductor device
RENESAS TECH CORP5 citations73
US7507606B2Mar 24, 2009
Semiconductor device and method of manufacturing the same
RENESAS TECH CORP6 citations71
US7482699B2Jan 27, 2009
Semiconductor device
RENESAS TECH CORP6 citations63
US7413930B2Aug 19, 2008
Lead frame and method of manufacturing the lead frame
RENESAS TECH CORP4 citations63
US6692989B2Feb 17, 2004
Plastic molded type semiconductor device and fabrication process thereof
RENESAS TECH CORP2 citations63
US7176487B2Feb 13, 2007
Semiconductor integrated circuit
RENESAS TECH CORP6 citations60
US7678706B2Mar 16, 2010
Method of manufacturing a semiconductor device
RENESAS TECH CORP0 citations52
US7374973B2May 20, 2008
Manufacturing method of semiconductor device and manufacturing method of lead frame
RENESAS TECH CORP0 citations52
US6791182B2Sep 14, 2004
Semiconductor device
RENESAS TECH CORP0 citations41
CANON KK
5 patentsUS9155212B2Oct 6, 2015
Electronic component, mounting member, electronic apparatus, and their manufacturing methods
CANON KK7 citations83
US9585287B2Feb 28, 2017
Electronic component, electronic apparatus, and method for manufacturing the electronic component
CANON KK2 citations72
US9220172B2Dec 22, 2015
Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus
CANON KK5 citations72
US9978675B2May 22, 2018
Package, electronic component, and electronic apparatus
CANON KK5 citations69
US9253922B2Feb 2, 2016
Electronic component and electronic apparatus
CANON KK0 citations41
HITACHI LTD
4 patentsUS6291273B1Sep 18, 2001
Plastic molded type semiconductor device and fabrication process thereof
HITACHI LTD208 citations99
US6396142B1May 28, 2002
Semiconductor device
HITACHI LTD21 citations92
US6943456B2Sep 13, 2005
Plastic molded type semiconductor device and fabrication process thereof
HITACHI LTD6 citations74
US6673655B2Jan 6, 2004
Method of making semiconductor device having improved heat radiation plate arrangement
HITACHI LTD2 citations62
HITACHI ULSI SYS CO LTD
4 patentsUS6989334B2Jan 24, 2006
Manufacturing method of a semiconductor device
HITACHI ULSI SYS CO LTD6 citations74
US7160759B2Jan 9, 2007
Semiconductor device and method of manufacturing the same
HITACHI ULSI SYS CO LTD8 citations71
US7247576B2Jul 24, 2007
Method of manufacturing a semiconductor device
HITACHI ULSI SYS CO LTD2 citations63
US6893898B2May 17, 2005
Semiconductor device and a method of manufacturing the same
HITACHI ULSI SYS CO LTD5 citations63