Inventor
MOK JEE-SOO
KR27 patents
⚠️ This page may combine multiple inventors who share the name “MOK JEE-SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
16 patentsUS7653991B2Feb 2, 2010
Method for manufacturing printed circuit board having embedded component
SAMSUNG ELECTRO MECH22 citations92
US7605459B2Oct 20, 2009
Coreless substrate and manufacturing thereof
SAMSUNG ELECTRO MECH21 citations92
US7435352B2Oct 14, 2008
Method of forming solder resist pattern
SAMSUNG ELECTRO MECH24 citations90
US7279412B2Oct 9, 2007
Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same
SAMSUNG ELECTRO MECH15 citations81
US10045444B2Aug 7, 2018
Printed circuit board, package and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations73
US9999131B2Jun 12, 2018
Printed circuit board with embedded electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH6 citations73
US10306778B2May 28, 2019
Printed circuit board with dam around cavity and manufacturing method thereof
SAMSUNG ELECTRO MECH3 citations72
US7836590B2Nov 23, 2010
Manufacturing method for printed circuit board
SAMSUNG ELECTRO MECH5 citations62
US8377748B2Feb 19, 2013
Method of manufacturing cooling fin and package substrate with cooling fin
SAMSUNG ELECTRO MECH2 citations61
US7622329B2Nov 24, 2009
Method for fabricating core substrate using paste bumps
SAMSUNG ELECTRO MECH2 citations60
US7169707B2Jan 30, 2007
Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
SAMSUNG ELECTRO MECH6 citations59
US7901985B2Mar 8, 2011
Method for manufacturing package on package with cavity
SAMSUNG ELECTRO MECH0 citations52
US9848492B2Dec 19, 2017
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations51
US7859106B2Dec 28, 2010
Multilayer printed circuit board using paste bumps
SAMSUNG ELECTRO MECH0 citations50
US7841074B2Nov 30, 2010
Method of fabricating paste bump for printed circuit board
SAMSUNG ELECTRO MECH0 citations41
US7973248B2Jul 5, 2011
Printed circuit board using paste bump and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations38