Inventor

FUKUZONO KENJI

JP26 patents

⚠️ This page may combine multiple inventors who share the name “FUKUZONO KENJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUKUZONO KENJI

FUJITSU LTD

Printed circuit board unit and semiconductor package

Electronic device and method for manufacturing same

Semiconductor device and a manufacturing method thereof

Semiconductor device having stiffener

Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program

Board design aiding apparatus, board design aiding method and board design aiding program

BGA package substrate and method of manufacturing the same

Optical module and method of manufacturing optical module

Packaging method, packaging structure and package substrate for electronic parts

Packaging method, packaging structure and package substrate for electronic parts

Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening

Semiconductor apparatus and manufacturing method thereof

Method of manufacturing semiconductor device mounting structure

Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus

Optical module

Optical module

Package substrate and method of manufacturing package substrate

Process for producing multilayer board

Package mounting structure

Printed wiring board unit

YOSHIMURA HIDEAKI

Method of making printed wiring board and method of making printed circuit board unit

Circuit board

FUKUZONO KENJI

Semiconductor device and heat radiation member

Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit board

WATANABE MANABU

Semiconductor package, wiring board unit, and electronic apparatus

KANDA TAKASHI

Semiconductor device and manufacturing method of a semiconductor device