Semiconductor apparatus and manufacturing method thereof

Abstract

A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other.

What is claimed is: 
     
       1. A semiconductor apparatus comprising:
 a package substrate on which a semiconductor device is disposed; 
 a mounting board over which the package substrate is mounted; 
 a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and 
 a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other, 
 wherein the first restraint includes
 a head that is in contact with a first surface on a side of the mounting board that is farther from the package substrate, 
 a hook that is openable and closable in a direction parallel to a second surface on a side of the package substrate that is farther from the mounting board, and that is hooked on the second surface, and 
 a joining section that joins the head and the hook. 
 
 
     
     
       2. The semiconductor apparatus according to  claim 1 , wherein
 the joining section has an elastic member. 
 
     
     
       3. The semiconductor apparatus according to  claim 1 , wherein
 the first restraint penetrates through an opening provided in the second restraint. 
 
     
     
       4. The semiconductor apparatus according to  claim 1 , wherein
 there is a gap between a side surface of a first opening that is provided in the package substrate and through which the first restraint penetrates and the joining section. 
 
     
     
       5. The semiconductor apparatus according to  claim 1 , wherein
 there is a gap between a side surface of a second opening that is provided in the mounting board and through which the first restraint penetrates and the joining section. 
 
     
     
       6. The semiconductor apparatus according to  claim 1 , wherein
 the first restraint and the second restraint are provided in two or more locations, which have different distances from the periphery of the package substrate. 
 
     
     
       7. The semiconductor apparatus according to  claim 1 , wherein
 the first restraint is made from metal. 
 
     
     
       8. The semiconductor apparatus according to  claim 1 , wherein
 a component connected to the semiconductor device is disposed on the package substrate. 
 
     
     
       9. A semiconductor apparatus manufacturing method comprising:
 placing, over a mounting board, a package substrate on which a semiconductor device is disposed; 
 mounting the package substrate over the mounting board by conducting reflow, and before the package substrate placing; 
 providing a first restraint including a head that is in contact with a first surface on a side of the mounting board that is farther from the package substrate, a hook that is openable and closable in a direction parallel to a second surface on a side of the package substrate that is farther from the mounting board, and that is hooked on the second surface, and a joining section that joins the head and the hook, the first restraint being provided so that the hook and the joining section penetrate through the mounting board and the head comes into contact with the first surface; and 
 providing, on the mounting board, a second restraint that restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other, 
 wherein during the package substrate placing, the package substrate is placed so that the hook is located in an opening provided in the package substrate while the hook is closed, and 
 wherein during the reflow, the package substrate is moved down to a side of the mounting board so that the hook projects from the opening and is hooked on the second surface. 
 
     
     
       10. The semiconductor apparatus manufacturing method according to  claim 9 , wherein
 the joining section has an elastic member. 
 
     
     
       11. The semiconductor apparatus manufacturing method according to  claim 9 , wherein
 during the second restraint providing, the second restraint is provided so that the hook and the joining section penetrate through an opening provided in the second restraint. 
 
     
     
       12. The semiconductor apparatus manufacturing method according to  claim 9 , wherein
 there is a gap between a side surface of a first opening that is provided in the package substrate and through which the first restraint penetrates and the joining section. 
 
     
     
       13. The semiconductor apparatus manufacturing method according to  claim 9 , wherein
 there is a gap between a side surface of a second opening that is provided in the mounting board and through which the first restraint penetrates and the joining section. 
 
     
     
       14. The semiconductor apparatus manufacturing method according to  claim 9 , wherein
 the first restraint and the second restraint are provided in two or more locations, which have different distances from the periphery of the package substrate. 
 
     
     
       15. The semiconductor apparatus manufacturing method according to  claim 9 , wherein
 the first restraint is made from metal. 
 
     
     
       16. The semiconductor apparatus manufacturing method according to  claim 9 , wherein
 a component connected to the semiconductor device is disposed on the package substrate.