Inventor
KO YEONGKWON
KR24 patents
Patents
24 patentsUS11424172B2Aug 23, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD6 citations83
US11869821B2Jan 9, 2024
Semiconductor package having molding layer with inclined side wall
SAMSUNG ELECTRONICS CO LTD4 citations72
US12062639B2Aug 13, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11923343B2Mar 5, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11462462B2Oct 4, 2022
Semiconductor packages including a recessed conductive post
SAMSUNG ELECTRONICS CO LTD3 citations71
US11239171B2Feb 1, 2022
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations71
US12237240B2Feb 25, 2025
Semiconductor package and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12002726B2Jun 4, 2024
Semiconductor package and method of manufacture
SAMSUNG ELECTRONICS CO LTD0 citations62
US11610828B2Mar 21, 2023
Semiconductor package and method of manufacture
SAMSUNG ELECTRONICS CO LTD0 citations62
US12165991B2Dec 10, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11996367B2May 28, 2024
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11721669B2Aug 8, 2023
Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widths
SAMSUNG ELECTRONICS CO LTD1 citations61
US11694963B2Jul 4, 2023
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11594499B2Feb 28, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12362328B2Jul 15, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12094794B2Sep 17, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11538792B2Dec 27, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11515226B2Nov 29, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12406888B2Sep 2, 2025
Semiconductor substrate and method of dicing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12355004B2Jul 8, 2025
Semiconductor chip and semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11923340B2Mar 5, 2024
Semiconductor package including mold layer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations50
US11791282B2Oct 17, 2023
Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US12476160B2Nov 18, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations46
US12218096B2Feb 4, 2025
Semiconductor package and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations46