Inventor
YOO JAEKYUNG
KR10 patents
Patents
10 patentsUS12062639B2Aug 13, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11923343B2Mar 5, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11462462B2Oct 4, 2022
Semiconductor packages including a recessed conductive post
SAMSUNG ELECTRONICS CO LTD3 citations71
US12165991B2Dec 10, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11594499B2Feb 28, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12362328B2Jul 15, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11538792B2Dec 27, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12394641B2Aug 19, 2025
Molding apparatus of semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11923340B2Mar 5, 2024
Semiconductor package including mold layer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations50
US11791282B2Oct 17, 2023
Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations49