Inventor
SMITH JOSEPH O
US29 patents
⚠️ This page may combine multiple inventors who share the name “SMITH JOSEPH O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
27 patentsUS6130473AOct 10, 2000
Lead frame chip scale package
NAT SEMICONDUCTOR CORP252 citations99
US6034423AMar 7, 2000
Lead frame design for increased chip pinout
NAT SEMICONDUCTOR CORP167 citations99
US5894108AApr 13, 1999
Plastic package with exposed die
NAT SEMICONDUCTOR CORP439 citations99
US5783870AJul 21, 1998
Method for connecting packages of a stacked ball grid array structure
NAT SEMICONDUCTOR CORP350 citations99
US6538313B1Mar 25, 2003
IC package with integral substrate capacitor
NAT SEMICONDUCTOR CORP79 citations98
US5986340ANov 16, 1999
Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same
NAT SEMICONDUCTOR CORP132 citations98
US5663593ASep 2, 1997
Ball grid array package with lead frame
NAT SEMICONDUCTOR CORP108 citations98
US6245595B1Jun 12, 2001
Techniques for wafer level molding of underfill encapsulant
NAT SEMICONDUCTOR CORP161 citations97
US6710246B1Mar 23, 2004
Apparatus and method of manufacturing a stackable package for a semiconductor device
NAT SEMICONDUCTOR CORP58 citations96
US6707148B1Mar 16, 2004
Bumped integrated circuits for optical applications
NAT SEMICONDUCTOR CORP46 citations96
US6117710ASep 12, 2000
Plastic package with exposed die and method of making same
NAT SEMICONDUCTOR CORP43 citations96
US6054772AApr 25, 2000
Chip sized package
NAT SEMICONDUCTOR CORP62 citations96
US7144800B2Dec 5, 2006
Multichip packages with exposed dice
NAT SEMICONDUCTOR CORP39 citations93
US7002241B1Feb 21, 2006
Packaging of semiconductor device with a non-opaque cover
NAT SEMICONDUCTOR CORP24 citations93
US6936929B1Aug 30, 2005
Multichip packages with exposed dice
NAT SEMICONDUCTOR CORP39 citations93
US5598321AJan 28, 1997
Ball grid array with heat sink
NAT SEMICONDUCTOR CORP36 citations93
US6984866B1Jan 10, 2006
Flip chip optical semiconductor on a PCB
NAT SEMICONDUCTOR CORP28 citations91
US7405100B1Jul 29, 2008
Packaging of a semiconductor device with a non-opaque cover
NAT SEMICONDUCTOR CORP15 citations84
USRE39854ESep 25, 2007
Lead frame chip scale package
NAT SEMICONDUCTOR CORP10 citations84
US7171745B2Feb 6, 2007
Apparatus and method for force mounting semiconductor packages to printed circuit boards
NAT SEMICONDUCTOR CORP9 citations74
US7098518B1Aug 29, 2006
Die-level opto-electronic device and method of making same
NAT SEMICONDUCTOR CORP7 citations74
US7012282B1Mar 14, 2006
Bumped integrated circuits for optical applications
NAT SEMICONDUCTOR CORP5 citations74
US6888228B1May 3, 2005
Lead frame chip scale package
NAT SEMICONDUCTOR CORP11 citations74
US6823582B1Nov 30, 2004
Apparatus and method for force mounting semiconductor packages to printed circuit boards
NAT SEMICONDUCTOR CORP10 citations74
US6589814B1Jul 8, 2003
Lead frame chip scale package
NAT SEMICONDUCTOR CORP8 citations74
US6352878B1Mar 5, 2002
Method for molding a bumped wafer
NAT SEMICONDUCTOR CORP11 citations74
US7468288B1Dec 23, 2008
Die-level opto-electronic device and method of making same
NAT SEMICONDUCTOR CORP0 citations52