Lead frame chip scale package

Abstract

A method for producing chip scale IC packages includes the step of mounting a lead frame panel on a temporary support fixture in order to provide support and protection during the manufacturing process. An embodiment of the temporary support fixture includes a sheet of sticky tape secured to a rigid frame. The rigid frame maintains tension in the sheet of sticky tape to provide a stable surface to which the lead frame panel can be affixed. Installation of IC chips and encapsulation in protective casings is performed as in conventional IC package manufacturing. If encapsulant material is to be dispensed over the IC chips, an encapsulant dam can be formed around the lead frame panel to contain the flow of encapsulant material. The temporary support fixture can be used in any IC package manufacturing process in which lead frames require supplemental support.

1. A fixture for providing temporary support to a lead frame during an IC package manufacturing process comprising an adhesive pad attached to a rigid frame, said rigid frame having an opening larger than said lead frame so as to accommodate said lead frame entirely within an outer periphery of said rigid frame, and such that said adhesive pad is held in tension by said rigid frame to provide a stable support surface for said lead frame. 
     
     
       2. The fixture of  claim 1  wherein said adhesive pad is constructed of single-sided sticky tape. 
     
     
       3. A fixture for providing temporary support to a lead frame during an IC package manufacturing process comprising an adhesive pad attached to a rigid frame such that said adhesive pad is held in tension by said rigid frame to provide a stable support surface for said lead frame, wherein said rigid frame comprises a stainless steel ring having an opening of a diameter larger than said lead frame. 
     
     
       4. The fixture of  claim 1  wherein said rigid frame includes a set of positioning features for positioning and aligning said lead frame and said adhesive pad with respect to said rigid frame. 
     
     
       5. The fixture of  claim 1  wherein said adhesive pad is patterned to facilitate a subsequent manufacturing step. 
     
     
       6. A fixture as in  claim 1 , wherein said lead frame includes multiple die attach pads for accommodating multiple integrated circuit dies. 
     
     
       7. A fixture as in  claim 1 , further comprises an encapsulation dam having an outer wall adapted for enclosing said lead frame. 
     
     
       8. A fixture as in  claim 1 , wherein each die attach pad is provided around its periphery multiple leads for wire-bonding. 
     
     
       9. A fixture as recited in  claim 1 , wherein the rigid frame is formed from stainless steel.