Inventor · disambiguated record
Joseph O. Smith
Also filed as: SMITH JOSEPH · SMITH JOSEPH E · SMITH JOSEPH O
30 granted patents·4 pending applications·2,329 citations·filing 1977–2010
98Inventor score
Top patents by PatentIndex Score
34 records- 0199US5894108APlastic package with exposed dieNAT SEMICONDUCTOR CORP·Filed 1997·Granted Apr 13, 1999·439 cites·3 claims
- 0298US6130473ALead frame chip scale packageNAT SEMICONDUCTOR CORP·Filed 1998·Granted Oct 10, 2000·252 cites·8 claims
- 0398US5783870AMethod for connecting packages of a stacked ball grid array structureNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jul 21, 1998·350 cites·15 claims
- 0494US8916742B2Anatomically engineered configured articleSMITH JOSEPH O·Filed 2010·Granted Dec 23, 2014·48 cites·9 claims
- 0594US6034423ALead frame design for increased chip pinoutNAT SEMICONDUCTOR CORP·Filed 1998·Granted Mar 7, 2000·167 cites·10 claims
- 0693US6538313B1IC package with integral substrate capacitorNAT SEMICONDUCTOR CORP·Filed 2001·Granted Mar 25, 2003·79 cites·10 claims
- 0791US6245595B1Techniques for wafer level molding of underfill encapsulantNAT SEMICONDUCTOR CORP·Filed 1999·Granted Jun 12, 2001·161 cites·15 claims
- 0891US5986340ABall grid array package with enhanced thermal and electrical characteristics and electronic device incorporating sameNAT SEMICONDUCTOR CORP·Filed 1996·Granted Nov 16, 1999·132 cites·9 claims
- 0990US6710246B1Apparatus and method of manufacturing a stackable package for a semiconductor deviceNAT SEMICONDUCTOR CORP·Filed 2002·Granted Mar 23, 2004·58 cites·15 claims
- 1089US5663593ABall grid array package with lead frameNAT SEMICONDUCTOR CORP·Filed 1995·Granted Sep 2, 1997·108 cites·8 claims
- 1188US7405100B1Packaging of a semiconductor device with a non-opaque coverNAT SEMICONDUCTOR CORP·Filed 2005·Granted Jul 29, 2008·15 cites·13 claims
- 1288US7144800B2Multichip packages with exposed diceNAT SEMICONDUCTOR CORP·Filed 2004·Granted Dec 5, 2006·39 cites·8 claims
- 1388US6936929B1Multichip packages with exposed diceNAT SEMICONDUCTOR CORP·Filed 2003·Granted Aug 30, 2005·39 cites·9 claims
- 1488US6707148B1Bumped integrated circuits for optical applicationsNAT SEMICONDUCTOR CORP·Filed 2002·Granted Mar 16, 2004·46 cites·13 claims
- 1581US6776769B2Anatomically configured tubular body of woven or knitted fabric for pressure support of articulating jointFiled 2001·Granted Aug 17, 2004·111 cites·11 claims
- 1681US6054772AChip sized packageNAT SEMICONDUCTOR CORP·Filed 1998·Granted Apr 25, 2000·62 cites·15 claims
- 1780US7002241B1Packaging of semiconductor device with a non-opaque coverNAT SEMICONDUCTOR CORP·Filed 2003·Granted Feb 21, 2006·24 cites·16 claims
- 1879US6984866B1Flip chip optical semiconductor on a PCBNAT SEMICONDUCTOR CORP·Filed 2003·Granted Jan 10, 2006·28 cites·14 claims
- 1977US6117710APlastic package with exposed die and method of making sameNAT SEMICONDUCTOR CORP·Filed 1998·Granted Sep 12, 2000·43 cites·6 claims
- 2069US6888228B1Lead frame chip scale packageNAT SEMICONDUCTOR CORP·Filed 2000·Granted May 3, 2005·11 cites·28 claims
- 2168USRE39854ELead frame chip scale packageNAT SEMICONDUCTOR CORP·Filed 2002·Granted Sep 25, 2007·10 cites·9 claims
- 2268US5598321ABall grid array with heat sinkNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jan 28, 1997·36 cites·19 claims
- 2367US4183348AFireplace frontSMITH JOSEPH O·Filed 1977·Granted Jan 15, 1980·21 cites·18 claims
- 2465US6823582B1Apparatus and method for force mounting semiconductor packages to printed circuit boardsNAT SEMICONDUCTOR CORP·Filed 2002·Granted Nov 30, 2004·10 cites·14 claims
- 2564US7171745B2Apparatus and method for force mounting semiconductor packages to printed circuit boardsNAT SEMICONDUCTOR CORP·Filed 2004·Granted Feb 6, 2007·9 cites·8 claims
- 2663US6352878B1Method for molding a bumped waferNAT SEMICONDUCTOR CORP·Filed 2000·Granted Mar 5, 2002·11 cites·11 claims
- 2759US7098518B1Die-level opto-electronic device and method of making sameNAT SEMICONDUCTOR CORP·Filed 2003·Granted Aug 29, 2006·7 cites·18 claims
- 2855US7012282B1Bumped integrated circuits for optical applicationsNAT SEMICONDUCTOR CORP·Filed 2003·Granted Mar 14, 2006·5 cites·16 claims
- 2950US7468288B1Die-level opto-electronic device and method of making sameNAT SEMICONDUCTOR CORP·Filed 2006·Granted Dec 23, 2008·0 cites·21 claims
- 3050US2007037320A1Multichip packages with exposed diceNAT SEMICONDUCTOR CORP·Filed 2006·Application pending·0 cites
- 3145US6589814B1Lead frame chip scale packageNAT SEMICONDUCTOR CORP·Filed 1999·Granted Jul 8, 2003·8 cites·23 claims
- 3244US2008021361A1Anatomically configured design for pressure support, comfort, protection of a joint and or body partSMITH JOSEPH O·Filed 2006·Application pending·0 cites
- 3341US2004031101A1Anatomically configured device for orthopedic support of the bodyFiled 2003·Application pending·0 cites
- 3438US2007144716A1Potted exchange devices and methods of makingDOH CHA P·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →