P

Inventor

ENDO KAZUHIKO

JP43 patents
⚠️ This page may combine multiple inventors who share the name “ENDO KAZUHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC CORP

19 patents
US6091081AJul 18, 2000

Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film

NEC CORP55 citations96
US6033979AMar 7, 2000

Method of fabricating a semiconductor device with amorphous carbon layer

NEC CORP76 citations96
US5698901ADec 16, 1997

Semiconductor device with amorphous carbon layer for reducing wiring delay

NEC CORP54 citations96
US5866920AFeb 2, 1999

Semiconductor device and manufacturing method of the same

NEC CORP78 citations95
US6071797AJun 6, 2000

Method for forming amorphous carbon thin film by plasma chemical vapor deposition

NEC CORP22 citations93
US6846743B2Jan 25, 2005

Method for vapor deposition of a metal compound film

NEC CORP23 citations92
US6149730ANov 21, 2000

Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor

NEC CORP50 citations92
US6121162ASep 19, 2000

Method of forming a fluorine-added insulating film

NEC CORP27 citations92
US5780121AJul 14, 1998

Method for preparing a fluoro-containing polyimide film

NEC CORP28 citations92
US6197704B1Mar 6, 2001

Method of fabricating semiconductor device

NEC CORP26 citations91
US7385265B2Jun 10, 2008

High dielectric constant MOSFET device

NEC CORP12 citations84
US6329295B1Dec 11, 2001

Semiconductor device capable of having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material and method of manufacturing the same

NEC CORP5 citations74
US6104092AAug 15, 2000

Semiconductor device having amorphous carbon fluoride film of low dielectric constant as interlayer insulation material

NEC CORP13 citations74
US5795655AAug 18, 1998

Method for preparing a fluoro-containing polyimide film

NEC CORP5 citations74
US6372628B1Apr 16, 2002

Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film, and a method for manufacturing the semiconductor device

NEC CORP11 citations73
US6180531B1Jan 30, 2001

Semiconductor manufacturing method

NEC CORP10 citations73
US5702773ADec 30, 1997

Method for preparing a fluoro-containing polyimide film

NEC CORP3 citations63
US7910474B2Mar 22, 2011

Method of manufacturing a semiconductor device

NEC CORP1 citations52
US7056839B2Jun 6, 2006

Method of forming a silica insulation film with a reduced dielectric constant

NEC CORP1 citations52

TEAC CORP

3 patents

SONY CORP

3 patents

NEC ELECTRONICS CORP

2 patents

LIU YONGXUN

2 patents

NAT INST OF ADVANCED IND SCIEN

2 patents

DENSO CORP

2 patents

WATANABE HEIJI

2 patents

FUJITSU LTD

1 patent

SUMITOMO METAL IND

1 patent

ENDO KAZUHIKO

1 patent

OUCHI SHINICHI

1 patent

SUMITOMO WIRING SYSTEMS

1 patent

MITSUBISHI HITACHI POWER SYS

1 patent

AIST

1 patent

SHIRAKAWA NAOKI

1 patent