Inventor

YU CHI-YEH

TW28 patents

⚠️ This page may combine multiple inventors who share the name “YU CHI-YEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YU CHI-YEH

TAIWAN SEMICONDUCTOR MFG CO LTD

Power grid structures and method of forming the same

Power strap structure for high performance and low current density

Power rail for preventing DC electromigration

System and method of electromigration mitigation in stacked IC designs

Via rail solution for high power electromigration

Power strap structure for high performance and low current density

Via rail solution for high power electromigration

Power strap structure for high performance and low current density

Switch cell structure and method

Power rail for preventing DC electromigration

Via rail solution for high power electromigration

Conductive line structures and method of forming same

Method of forming power grid structures

Method of inserting dummy boundary cells for macro/IP and IC

Dummy cells placed adjacent functional blocks

Duplicate layering and routing

Method for forming through-silicon via (TSV) with diffused isolation well

Integrated circuit with dummy boundary cells

System for and method of checking joule heating of an integrated circuit design

MEDIATEK INC

Mobile communication device and data reception method

Method of scaling input data and mobile device utilizing the same

Timing synchronization in wireless communication system

TAIWAN SEMICONDUCTOR MFG

System and method for across-chip thermal and power management in stacked IC designs

Generating database for cells routable in pin layer

YU CHI-YEH

System and method of electromigration mitigation in stacked IC designs

Method and structure for through-silicon via (TSV) with diffused isolation well

KAO JERRY

System and method of electromigration avoidance for automatic place-and-route

TSENG NAN-HSIN

3D-IC interposer testing structure and method of testing the structure