Inventor

LIAO CHUNG-HSING

TW4 patents

Patents

4 patents

US9860990B1Jan 2, 2018

Circuit board structure with chips embedded therein and manufacturing method thereof

BOARDTEK ELECTRONICS CORP14 citations80

US11129283B2Sep 21, 2021

Method of electroplating a circuit board

BOARDTEK ELECTRONICS CORP0 citations47

US9271387B2Feb 23, 2016

Circuit board structure manufacturing method

BOARDTEK ELECTRONICS CORP1 citations47

US12074357B2Aug 27, 2024

Electromagnetic wave transmission board comprising an inner board with a plated through hole covered by outer plates, where the electromagnetic waves propagate in the through hole without leakage

BOARDTEK ELECTRONICS CORP0 citations44