Inventor

GANDHI JASPREET S

US66 patents

⚠️ This page may combine multiple inventors who share the name “GANDHI JASPREET S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GANDHI JASPREET S

MICRON TECHNOLOGY INC

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Interconnect structures with intermetallic palladium joints and associated systems and methods

Thermal pads between stacked semiconductor dies and associated systems and methods

Semiconductor device test apparatuses

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

Methods of forming semiconductor device assemblies and interconnect structures, and related semiconductor device assemblies and interconnect structures

Bonding pads with thermal pathways

Interconnect structure with improved conductive properties and associated systems and methods

Stacked semiconductor die assemblies with high efficiency thermal paths and associated systems

Methods for processing semiconductor devices

Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant

Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant

Semiconductor device assembly with through-mold cooling channel formed in encapsulant

Semiconductor devices and methods for backside photo alignment

Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods

Bonding pads with thermal pathways

Bonding pads with thermal pathways

Semiconductor device test apparatuses comprising at least one test site having an array of pockets

Interconnect structures with intermetallic palladium joints and associated systems and methods

Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods

Bonding pads with thermal pathways

Interconnect structure with improved conductive properties and associated systems and methods

Interconnect structures with intermetallic palladium joints and associated systems and methods

Uniform back side exposure of through-silicon vias

Semiconductor device having through-silicon-via and methods of forming the same

Semiconductor structures comprising at least one through-substrate via filled with conductive materials

Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods

Solder bond site including an opening with discontinuous profile

Semiconductor devices and methods for backside photo alignment

Thermal pads between stacked semiconductor dies and associated systems and methods

Methods of testing semiconductor devices comprising a die stack having protruding conductive elements

Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

Semiconductor device assembly with through-mold cooling channel formed in encapsulant

Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods

Bonding pads with thermal pathways

Uniform back side exposure of through-silicon vias

Semiconductor devices having conductive vias and methods of forming the same

Interconnect structures with intermetallic palladium joints and associated systems and methods

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Methods for forming interconnect assemblies with probed bond pads

Thermal pads between stacked semiconductor dies and associated systems and methods

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Interconnect structures with intermetallic palladium joints and associated systems and methods

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

GANDHI JASPREET S

Semiconductor assemblies and structures

Semiconductor constructions

Methods for forming a semiconductor structure

SUN YANGYANG

Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages