Inventor
HUANG WAYNE H
US15 patents
⚠️ This page may combine multiple inventors who share the name “HUANG WAYNE H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
14 patentsUS9397078B1Jul 19, 2016
Semiconductor device assembly with underfill containment cavity
MICRON TECHNOLOGY INC24 citations93
US9412675B2Aug 9, 2016
Interconnect structure with improved conductive properties and associated systems and methods
MICRON TECHNOLOGY INC8 citations84
US9837383B2Dec 5, 2017
Interconnect structure with improved conductive properties and associated systems and methods
MICRON TECHNOLOGY INC2 citations73
US10410879B2Sep 10, 2019
Uniform back side exposure of through-silicon vias
MICRON TECHNOLOGY INC2 citations72
US9941190B2Apr 10, 2018
Semiconductor device having through-silicon-via and methods of forming the same
MICRON TECHNOLOGY INC2 citations72
US11081460B2Aug 3, 2021
Methods and systems for manufacturing pillar structures on semiconductor devices
MICRON TECHNOLOGY INC5 citations69
US11631630B2Apr 18, 2023
Pillar-last methods for forming semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US11239129B2Feb 1, 2022
Package cooling by coil cavity
MICRON TECHNOLOGY INC0 citations62
US10957625B2Mar 23, 2021
Pillar-last methods for forming semiconductor devices
MICRON TECHNOLOGY INC1 citations62
US9818622B2Nov 14, 2017
Uniform back side exposure of through-silicon vias
MICRON TECHNOLOGY INC1 citations62
US11735549B2Aug 22, 2023
Methods and systems for manufacturing pillar structures on semiconductor devices
MICRON TECHNOLOGY INC0 citations59
US10763186B2Sep 1, 2020
Package cooling by coil cavity
MICRON TECHNOLOGY INC0 citations51
US10692733B2Jun 23, 2020
Uniform back side exposure of through-silicon vias
MICRON TECHNOLOGY INC0 citations51
US10262922B2Apr 16, 2019
Semiconductor device having through-silicon-via and methods of forming the same
MICRON TECHNOLOGY INC0 citations51