Inventor
ESHUN EBENEZER E
US62 patents
⚠️ This page may combine multiple inventors who share the name “ESHUN EBENEZER E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
39 patentsUS7949983B2May 24, 2011
High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
IBM14 citations93
US7902629B2Mar 8, 2011
Integrated BEOL thin film resistor
IBM16 citations93
US7670921B2Mar 2, 2010
Structure and method for self aligned vertical plate capacitor
IBM31 citations93
US7662722B2Feb 16, 2010
Air gap under on-chip passive device
IBM31 citations93
US7361993B2Apr 22, 2008
Terminal pad structures and methods of fabricating same
IBM21 citations93
US7282404B2Oct 16, 2007
Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme
IBM16 citations93
US7217981B2May 15, 2007
Tunable temperature coefficient of resistance resistors and method of fabricating same
IBM36 citations93
US6876028B1Apr 5, 2005
Metal-insulator-metal capacitor and method of fabrication
IBM34 citations93
US7768055B2Aug 3, 2010
Passive components in the back end of integrated circuits
IBM28 citations92
US6992344B2Jan 31, 2006
Damascene integration scheme for developing metal-insulator-metal capacitors
IBM24 citations92
US7361950B2Apr 22, 2008
Integration of a MIM capacitor with a plate formed in a well region and with a high-k dielectric
IBM17 citations91
US8378450B2Feb 19, 2013
Interdigitated vertical parallel capacitor
IBM12 citations84
US7994895B2Aug 9, 2011
Heat sink for integrated circuit devices
IBM8 citations84
US7825441B2Nov 2, 2010
Junction field effect transistor with a hyperabrupt junction
IBM16 citations84
US7659176B2Feb 9, 2010
Tunable temperature coefficient of resistance resistors and method of fabricating same
IBM9 citations84
US7645675B2Jan 12, 2010
Integrated parallel plate capacitors
IBM16 citations84
US7585722B2Sep 8, 2009
Integrated circuit comb capacitor
IBM9 citations84
US7528048B2May 5, 2009
Planar vertical resistor and bond pad resistor and related method
IBM12 citations84
US7494912B2Feb 24, 2009
Terminal pad structures and methods of fabricating same
IBM9 citations84
US7485540B2Feb 3, 2009
Integrated BEOL thin film resistor
IBM11 citations84
US7394145B2Jul 1, 2008
Methods of fabricating passive element without planarizing and related semiconductor device
IBM10 citations84
US7271700B2Sep 18, 2007
Thin film resistor with current density enhancing layer (CDEL)
IBM14 citations84
US6940117B2Sep 6, 2005
Prevention of Ta2O5 mim cap shorting in the beol anneal cycles
IBM13 citations84
US7910450B2Mar 22, 2011
Method of fabricating a precision buried resistor
IBM7 citations83
US7301752B2Nov 27, 2007
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
IBM10 citations82
US8039354B2Oct 18, 2011
Passive components in the back end of integrated circuits
IBM6 citations74
US7427550B2Sep 23, 2008
Methods of fabricating passive element without planarizing
IBM5 citations74
US7394110B2Jul 1, 2008
Planar vertical resistor and bond pad resistor
IBM5 citations74
US7145218B2Dec 5, 2006
Thin-film resistor and method of manufacturing the same
IBM8 citations74
US6969903B2Nov 29, 2005
High tolerance TCR balanced high current resistor for RF CMOS and RF SiGe BiCMOS applications and cadenced based hierarchical parameterized cell design kit with tunable TCR and ESD resistor ballasting feature
IBM6 citations74
US7382055B2Jun 3, 2008
Integrated thin-film resistor with direct contact
IBM7 citations73
US7303972B2Dec 4, 2007
Integrated thin-film resistor with direct contact
IBM6 citations73
US7915134B2Mar 29, 2011
Method of integration of a MIM capacitor with a lower plate of metal gate material formed on an STI region or a silicide region formed in or on the surface of a doped well with a high K dielectric material
IBM6 citations72
US7687867B2Mar 30, 2010
Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme
IBM5 citations63
US7310036B2Dec 18, 2007
Heat sink for integrated circuit devices
IBM2 citations63
US7239006B2Jul 3, 2007
Resistor tuning
IBM5 citations63
US7098521B2Aug 29, 2006
Reduced guard ring in schottky barrier diode structure
IBM4 citations63
US7728372B2Jun 1, 2010
Method and structure for creation of a metal insulator metal capacitor
IBM3 citations62
US7691717B2Apr 6, 2010
Polysilicon containing resistor with enhanced sheet resistance precision and method for fabrication thereof
IBM5 citations62
COOLBAUGH DOUGLAS D
4 patentsUS8881379B2Nov 11, 2014
Method of making heat sink for integrated circuit devices
COOLBAUGH DOUGLAS D4 citations84
US8125049B2Feb 28, 2012
MIM capacitor structure in FEOL and related method
COOLBAUGH DOUGLAS D7 citations84
US8159040B2Apr 17, 2012
Metal gate integration structure and method including metal fuse, anti-fuse and/or resistor
COOLBAUGH DOUGLAS D15 citations83
US8230586B2Jul 31, 2012
Method of cooling a resistor
COOLBAUGH DOUGLAS D4 citations74
CHINTHAKINDI ANIL K
3 patentsUS8093679B2Jan 10, 2012
Integrated BEOL thin film resistor
CHINTHAKINDI ANIL K5 citations73
US8119491B2Feb 21, 2012
Methods of fabricating passive element without planarizing and related semiconductor device
CHINTHAKINDI ANIL K2 citations62
US8207568B2Jun 26, 2012
Process for single and multiple level metal-insulator-metal integration with a single mask
CHINTHAKINDI ANIL K2 citations61
DALTON TIMOTHY J
2 patentsUS8298902B2Oct 30, 2012
Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit
DALTON TIMOTHY J11 citations82
US8791545B2Jul 29, 2014
Interconnect structures and design structures for a radiofrequency integrated circuit
DALTON TIMOTHY J2 citations60
WALLNER THOMAS A
1 patentEDELSTEIN DANIEL C
1 patentShowing the top 50 of 62 patents by PatentIndex Score.