P

Inventor

CHEN TSUNG-YU

TW81 patents
⚠️ This page may combine multiple inventors who share the name “CHEN TSUNG-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

27 patents
US9869934B2Jan 16, 2018

Collector in an extreme ultraviolet lithography system with optimal air curtain protection

TAIWAN SEMICONDUCTOR MFG CO LTD148 citations99
US11594469B2Feb 28, 2023

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US11062971B2Jul 13, 2021

Package structure and method and equipment for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US11282825B2Mar 22, 2022

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10978373B2Apr 13, 2021

Semiconductor device methods of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10867885B2Dec 15, 2020

Heat spreading device and method

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10515867B2Dec 24, 2019

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10483187B2Nov 19, 2019

Heat spreading device and method

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10461014B2Oct 29, 2019

Heat spreading device and method

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US10269682B2Apr 23, 2019

Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US11302600B2Apr 12, 2022

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10790254B2Sep 29, 2020

Chip package structure

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11929293B2Mar 12, 2024

Semiconductor package with lid structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11923310B2Mar 5, 2024

Package structure including through via structures

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11810833B2Nov 7, 2023

Package structure and method and equipment for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11088079B2Aug 10, 2021

Package structure having line connected via portions

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11088048B2Aug 10, 2021

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11018073B2May 25, 2021

Heat spreading device and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11004771B2May 11, 2021

Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10867884B2Dec 15, 2020

Heat spreading device and method

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10153218B2Dec 11, 2018

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9665007B2May 30, 2017

Rotary EUV collector

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11756870B2Sep 12, 2023

Stacked via structure disposed on a conductive pillar of a semiconductor die

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10985125B2Apr 20, 2021

Chip package structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12387988B2Aug 12, 2025

Method of manufacturing semiconductor package having lid structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12272612B2Apr 8, 2025

Semiconductor package module and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12074154B2Aug 27, 2024

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

(unassigned)

13 patents

CHEN TSUNG-YU

4 patents

ADVANCED EPITAXY TECHNOLOGY

2 patents

CHEN TSUNG YU

1 patent

TAIWAN SEMICONDUCTOR MFG

1 patent

INTEL CORP

1 patent

IBM

1 patent

Showing the top 50 of 81 patents by PatentIndex Score.