Inventor

TSAI FANG WEN

TW24 patents

⚠️ This page may combine multiple inventors who share the name “TSAI FANG WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI FANG WEN

TAIWAN SEMICONDUCTOR MFG

Method for metal gate N/P patterning

High selectivity etching process for metal gate N/P patterning

Solution for FSG induced metal corrosion &amp; metal peeling defects with extra bias liner and smooth RF bias ramp up

Through silicon via structure

Extreme low-k dielectric film scheme for advanced interconnect

Extreme low-K dielectric film scheme for advanced interconnects

Method for forming dielectric film to improve adhesion of low-k film

Copper bump structures having sidewall protection layers

Reconfigurable guide pin design for centering wafers having different sizes

Through silicon via structure

TAIWAN SEMICONDUCTOR MFG CO LTD

Alignment marks in substrate having through-substrate via (TSV)

Alignment mark and method of formation

Alignment marks in substrate having through-substrate via (TSV)

Alignment marks in substrate having through-substrate via (TSV)

Through silicon via structure

Method for through silicon via structure

CHANG HSIN

Alignment marks in substrate having through-substrate via (TSV)

Reconfigurable guide pin design for centering wafers having different sizes

YU CHEN-HUA

Method for producing a protective structure

Reducing substrate warpage in semiconductor processing

LIN JING-CHENG

Copper bump structures having sidewall protection layers

TSAI CHEN-YU

Alignment mark and method of formation

CHAN BOR-WEN

Replacement gate FinFET devices and methods for forming the same

YEH MATT

Double treatment on hard mask for gate N/P patterning

Solution for FSG induced metal corrosion & metal peeling defects with extra bias liner and smooth RF bias ramp up