Inventor
LOW BOON YEW
MY26 patents
⚠️ This page may combine multiple inventors who share the name “LOW BOON YEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LOW BOON YEW
7 patentsUS8338236B1Dec 25, 2012
Vented substrate for semiconductor device
LOW BOON YEW12 citations82
US9418929B1Aug 16, 2016
Integrated circuit with sewn interconnects
LOW BOON YEW3 citations68
US8698288B1Apr 15, 2014
Flexible substrate with crimping interconnection
LOW BOON YEW2 citations57
US9351407B1May 24, 2016
Method for forming multilayer device having solder filled via connection
LOW BOON YEW0 citations51
US8643189B1Feb 4, 2014
Packaged semiconductor die with power rail pads
LOW BOON YEW0 citations51
US8338828B2Dec 25, 2012
Semiconductor package and method of testing same
LOW BOON YEW0 citations48
US9165862B1Oct 20, 2015
Semiconductor device with plated through holes
LOW BOON YEW0 citations41
NXP USA INC
5 patentsUS11581241B2Feb 14, 2023
Circuit modules with front-side interposer terminals and through-module thermal dissipation structures
NXP USA INC3 citations72
US11056457B2Jul 6, 2021
Semiconductor device with bond wire reinforcement structure
NXP USA INC2 citations72
US12415305B2Sep 16, 2025
Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes
NXP USA INC0 citations61
US11787097B2Oct 17, 2023
Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes
NXP USA INC0 citations61
US12446158B2Oct 14, 2025
Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules
NXP USA INC0 citations46