Inventor
PARK YOUNGWOO
KR83 patents
⚠️ This page may combine multiple inventors who share the name “PARK YOUNGWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS9595346B2Mar 14, 2017
3-Dimensional semiconductor memory device and operating method thereof
SAMSUNG ELECTRONICS CO LTD22 citations94
US9685452B2Jun 20, 2017
Three-dimensional semiconductor device with vertical and horizontal channels in stack structure having electrodes vertically stacked on the substrate
SAMSUNG ELECTRONICS CO LTD25 citations93
US9515087B2Dec 6, 2016
Three-dimensional semiconductor memory device
SAMSUNG ELECTRONICS CO LTD32 citations93
US9437483B2Sep 6, 2016
Methods for forming etch stop layers, semiconductor devices having the same, and methods for fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD16 citations92
US10229927B2Mar 12, 2019
Semiconductor device and method of manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD18 citations85
US10002877B2Jun 19, 2018
Three-dimensional semiconductor devices and fabricating methods thereof
SAMSUNG ELECTRONICS CO LTD8 citations84
US9559112B2Jan 31, 2017
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US9385139B2Jul 5, 2016
Three dimensional semiconductor memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD13 citations84
US8796091B2Aug 5, 2014
Three-dimensional semiconductor memory devices
SAMSUNG ELECTRONICS CO LTD9 citations84
US8379456B2Feb 19, 2013
Nonvolatile memory devices having dummy cell and bias methods thereof
SAMSUNG ELECTRONICS CO LTD14 citations84
US10096616B2Oct 9, 2018
Three-dimensional semiconductor device with vertical and horizontal channels in stack structure having electrodes vertically stacked on the substrate
SAMSUNG ELECTRONICS CO LTD6 citations83
US10032789B2Jul 24, 2018
Three-dimensional semiconductor memory device
SAMSUNG ELECTRONICS CO LTD10 citations82
US9837429B2Dec 5, 2017
Method of fabricating a three-dimensional semiconductor memory device having a plurality of memory blocks on a peripheral logic structure
SAMSUNG ELECTRONICS CO LTD5 citations82
US11621233B2Apr 4, 2023
Semiconductor package including an electromagnetic shield and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations73
US11183466B2Nov 23, 2021
Semiconductor package including an electromagnetic shield and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations73
US10566233B2Feb 18, 2020
Semiconductor device having interconnection structure
SAMSUNG ELECTRONICS CO LTD1 citations73
US9865685B2Jan 9, 2018
Three-dimensional semiconductor memory devices including a vertical channel
SAMSUNG ELECTRONICS CO LTD2 citations73
US9768193B2Sep 19, 2017
Three-dimensional (3D) semiconductor devices and methods of fabricating 3D semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations73
US9847346B2Dec 19, 2017
Three-dimensional semiconductor memory device
SAMSUNG ELECTRONICS CO LTD5 citations72
US10332902B2Jun 25, 2019
Three-dimensional semiconductor memory device including vertically stacked electrodes
SAMSUNG ELECTRONICS CO LTD3 citations71
US9768018B2Sep 19, 2017
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations70
PARK JINTAEK
7 patentsUS9601204B2Mar 21, 2017
Three-dimensional semiconductor devices and fabricating methods thereof
PARK JINTAEK5 citations84
US9337207B2May 10, 2016
Semiconductor devices including word line interconnecting structures
PARK JINTAEK14 citations84
US9224429B2Dec 29, 2015
Three-dimensional semiconductor devices and methods of fabricating the same
PARK JINTAEK5 citations84
US9019739B2Apr 28, 2015
Three-dimensional semiconductor devices and methods of fabricating the same
PARK JINTAEK14 citations84
US8822971B2Sep 2, 2014
Semiconductor memory device having three-dimensionally arranged resistive memory cells
PARK JINTAEK12 citations84
US8735860B2May 27, 2014
Variable resistance memory device and method of fabricating the same
PARK JINTAEK9 citations84
US9281019B2Mar 8, 2016
Three-dimensional semiconductor devices
PARK JINTAEK4 citations73
LEE JAEGOO
6 patentsUS8704288B2Apr 22, 2014
Methods for forming etch stop layers, semiconductor devices having the same, and methods for fabricating semiconductor devices
LEE JAEGOO40 citations94
US8741761B2Jun 3, 2014
Methods of manufacturing three-dimensional semiconductor devices
LEE JAEGOO28 citations91
US9362303B2Jun 7, 2016
Semiconductor memory devices including fine patterns and methods of fabricating the same
LEE JAEGOO19 citations84
US9362226B2Jun 7, 2016
Three-dimensional (3D) semiconductor devices and methods of fabricating 3D semiconductor devices
LEE JAEGOO7 citations84
US8822322B2Sep 2, 2014
Semiconductor devices and methods of fabricating the same
LEE JAEGOO15 citations84
US8742488B2Jun 3, 2014
Three-dimensional semiconductor memory devices and methods of fabricating the same
LEE JAEGOO5 citations82
SAMSUNG DISPLAY CO LTD
3 patentsUS11625119B2Apr 11, 2023
Display device including an input sensor having a corner area
SAMSUNG DISPLAY CO LTD3 citations73
US11580914B2Feb 14, 2023
Display apparatus
SAMSUNG DISPLAY CO LTD3 citations73
US11812651B2Nov 7, 2023
Flexible display device with anti-reflection layer and method for manufacturing same
SAMSUNG DISPLAY CO LTD2 citations72
SIM JAESUNG
2 patentsKANAMORI KOHJI
2 patentsLEE JAEDUK
2 patentsLEE DOHYUN
2 patentsLEE CHANGHYUN
2 patentsYUN JANG-GN
1 patentCHANG SUNG-IL
1 patentSEO YUJEONG
1 patentShowing the top 50 of 83 patents by PatentIndex Score.