Inventor
FU LEI
CN38 patents
⚠️ This page may combine multiple inventors who share the name “FU LEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
11 patentsUS11676940B2Jun 13, 2023
Hybrid bonded interconnect bridging
ADVANCED MICRO DEVICES INC2 citations73
US11367628B2Jun 21, 2022
Molded chip package with anchor structures
ADVANCED MICRO DEVICES INC2 citations72
US10943880B2Mar 9, 2021
Semiconductor chip with reduced pitch conductive pillars
ADVANCED MICRO DEVICES INC3 citations72
US12249519B2Mar 11, 2025
Molded chip package with anchor structures
ADVANCED MICRO DEVICES INC1 citations63
US12107075B2Oct 1, 2024
Hybrid bonded interconnect bridging
ADVANCED MICRO DEVICES INC0 citations62
US11676924B2Jun 13, 2023
Semiconductor chip with reduced pitch conductive pillars
ADVANCED MICRO DEVICES INC0 citations62
US10903168B2Jan 26, 2021
Multi-RDL structure packages and methods of fabricating the same
ADVANCED MICRO DEVICES INC0 citations62
US12374645B2Jul 29, 2025
Electronic device including dies and an interconnect coupled to the dies and processes of forming the same
ADVANCED MICRO DEVICES INC0 citations61
US11742301B2Aug 29, 2023
Fan-out package with reinforcing rivets
ADVANCED MICRO DEVICES INC1 citations61
US11309222B2Apr 19, 2022
Semiconductor chip with solder cap probe test pads
ADVANCED MICRO DEVICES INC0 citations61
US9449907B2Sep 20, 2016
Stacked semiconductor chips packaging
ADVANCED MICRO DEVICES INC1 citations44
SU MICHAEL Z
3 patentsGLOBALFOUNDRIES INC
3 patentsUS7737563B2Jun 15, 2010
Semiconductor chip with reinforcement structure
GLOBALFOUNDRIES INC11 citations84
US7679200B2Mar 16, 2010
Semiconductor chip with crack stop
GLOBALFOUNDRIES INC8 citations83
US7977160B2Jul 12, 2011
Semiconductor devices having stress relief layers and methods for fabricating the same
GLOBALFOUNDRIES INC4 citations57