Inventor

HIRANO KOICHI

JP89 patents

⚠️ This page may combine multiple inventors who share the name “HIRANO KOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIRANO KOICHI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Magnetic element and method of manufacturing the same

Connection member and mount assembly and production method of the same

Transfer material for wiring substrate

Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink

Circuit component built-in module, radio device having the same, and method for producing the same

Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same

Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein

Electronic component built-in module and method of manufacturing the same

Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same

Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the same

Power module and method of manufacturing the same

Power module with improved heat dissipation

Method for producing a capacitor-embedded circuit board

Thermal conductive substrate and semiconductor module using the same

Wiring substrate produced by transfer material method

Power module and method of manufacturing the same

Method for manufacturing circuit board and circuit board and power conversion module using the same

Thermal conductive substrate and the method for manufacturing the same

Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection

Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection

Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor

Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor

Circuit component built-in module, radio device having the same, and method for producing the same

Semiconductor device and method for manufacturing the same

Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink

Thermally conductive substrate, thermally conductive substrate manufacturing method and power module

Composition for substrate materials and process for the same as well as a heat conductive substrate and process for the same

PANASONIC CORP

Method for producing connection member

Flexible semiconductor device

Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

Manufacturing method for electronic device

Method for presenting tactile sensation and device therefor

Method for presenting tactile sensation and device therefor

Manufacturing method of flexible semiconductor device

Flexible semiconductor device and method for manufacturing same

MITSUBISHI PENCIL CO

Process for producing self-inking stamp and self-inking stamp

Process for preparing stamp

Process of producing a printing plate for a stamp

Method of producing an impregnation stamp and an impregnation stamp produced thereby

PANASONIC IP MAN CO LTD

Flexible substrate including stretchable sheet

Tactile sensor that includes two sheets each having at least either flexibility or elasticity

Flexible touch sensor and method of manufacturing the same

BRIDGESTONE TIRE CO LTD

Method for making a ring-shaped mold

Method for manufacturing tire molding metal molds with a two-stage electrical discharge machining process

YASKAWA DENKI SEISAKUSHO KK

Power converting apparatus and method using a multiple three-phase PWM cycloconverter system

SUZUKI TAKESHI

Flexible semiconductor device, method for manufacturing the same, image display device using the same and method for manufacturing the image display device

HIRANO KOICHI

Method for manufacturing flexible semiconductor device

NEC CORP

Wireless communication system and method