Inventor
LIU YU-CHIA
TW27 patents
⚠️ This page may combine multiple inventors who share the name “LIU YU-CHIA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
17 patentsUS9695039B1Jul 4, 2017
Multi-pressure MEMS package
TAIWAN SEMICONDUCTOR MFG CO LTD17 citations92
US9029961B2May 12, 2015
Wafer level method of sealing different pressure levels for MEMS sensors
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9938134B2Apr 10, 2018
Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations80
US10689247B2Jun 23, 2020
Method and structure for CMOS-MEMS thin film encapsulation
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9221674B1Dec 29, 2015
Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9035451B2May 19, 2015
Wafer level sealing methods with different vacuum levels for MEMS sensors
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9403673B2Aug 2, 2016
Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12134555B2Nov 5, 2024
Method and structure for CMOS-MEMS thin film encapsulation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11667517B2Jun 6, 2023
Method and structure for CMOS-MEMS thin film encapsulation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11312623B2Apr 26, 2022
Semiconductor structure for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10752497B2Aug 25, 2020
Semiconductor structure for MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10494252B2Dec 3, 2019
MEMS devices and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10273144B2Apr 30, 2019
Multi-pressure MEMS package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10160639B2Dec 25, 2018
Semiconductor structure for MEMS Device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9868628B2Jan 16, 2018
Method and structure for CMOS-MEMS thin film encapsulation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10273148B2Apr 30, 2019
Micro-electro-mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
US10202278B2Feb 12, 2019
Semiconductor structure with cavity spacing monitoring functions
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41