Inventor
CHEN YEONG-E
TW30 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YEONG-E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INNOLUX CORP
27 patentsUS12200857B2Jan 14, 2025
Package device
INNOLUX CORP1 citations73
US11694999B2Jul 4, 2023
Electronic device and fabrication method thereof
INNOLUX CORP2 citations72
US11582865B2Feb 14, 2023
Package device
INNOLUX CORP2 citations72
US11551970B2Jan 10, 2023
Method for manufacturing an electronic device
INNOLUX CORP2 citations72
US11398430B2Jul 26, 2022
Package device and a manufacturing method thereof
INNOLUX CORP2 citations72
US11769685B2Sep 26, 2023
Manufacturing method of semiconductor package
INNOLUX CORP2 citations71
US11406015B2Aug 2, 2022
Bonding pad structure
INNOLUX CORP2 citations70
US12581958B2Mar 17, 2026
Electronic assembly
INNOLUX CORP0 citations62
US12376224B2Jul 29, 2025
Package device
INNOLUX CORP0 citations62
US12308289B2May 20, 2025
Method for manufacturing an electronic device
INNOLUX CORP0 citations62
US12266646B2Apr 1, 2025
Electronic device
INNOLUX CORP0 citations62
US12224226B2Feb 11, 2025
Electronic device
INNOLUX CORP0 citations62
US12205854B2Jan 21, 2025
Electronic device
INNOLUX CORP1 citations62
US12148630B2Nov 19, 2024
Method for manufacturing electronic device
INNOLUX CORP0 citations62
US12148658B2Nov 19, 2024
Method for manufacturing an electronic device
INNOLUX CORP0 citations62
US12142554B2Nov 12, 2024
Electronic component and manufacturing method thereof
INNOLUX CORP0 citations62
US11901315B2Feb 13, 2024
Package device
INNOLUX CORP0 citations62
US11789066B2Oct 17, 2023
Method for manufacturing electronic device having a seed layer on a substrate
INNOLUX CORP0 citations62
US11378618B2Jul 5, 2022
Method for manufacturing electronic device having a seed layer on a substrate
INNOLUX CORP0 citations62
US12541124B2Feb 3, 2026
Electronic device
INNOLUX CORP0 citations61
US12148686B2Nov 19, 2024
Package device and manufacturing method thereof
INNOLUX CORP0 citations61
US12050374B2Jul 30, 2024
Electronic device
INNOLUX CORP0 citations61
US11812549B2Nov 7, 2023
Package device and manufacturing method thereof
INNOLUX CORP0 citations61
US11776914B2Oct 3, 2023
Package device
INNOLUX CORP0 citations61
US12075566B2Aug 27, 2024
Bonding pad structure
INNOLUX CORP0 citations60
US11798853B2Oct 24, 2023
Manufacturing method of package device
INNOLUX CORP0 citations60
US12354919B2Jul 8, 2025
Manufacturing method of package circuit
INNOLUX CORP0 citations49