Inventor
AGNEW DOUGLAS WALTER
US11 patents
Patents
11 patentsUS10340136B1Jul 2, 2019
Minimization of carbon loss in ALD SiO2 deposition on hardmask films
LAM RES CORP1 citations60
US12020923B2Jun 25, 2024
Low-κ ALD gap-fill methods and material
LAM RES CORP0 citations59
US12473633B2Nov 18, 2025
Plasma enhanced atomic layer deposition of silicon-containing films
LAM RES CORP0 citations58
US12417943B2Sep 16, 2025
Reducing intralevel capacitance in semiconductor devices
LAM RES CORP0 citations58
US12252782B2Mar 18, 2025
In-situ PECVD cap layer
LAM RES CORP0 citations56
USD1107670SDec 30, 2025
Showerhead for a substrate processing system
LAM RES CORP0 citations51
US10692717B2Jun 23, 2020
Minimization of carbon loss in ALD SiO2 deposition on hardmask films
LAM RES CORP0 citations50
US12431349B2Sep 30, 2025
In-situ control of film properties during atomic layer deposition
LAM RES CORP0 citations48
US12157945B2Dec 3, 2024
Thermal atomic layer deposition of silicon-containing films
LAM RES CORP0 citations47
US12087574B2Sep 10, 2024
Oxidative conversion in atomic layer deposition processes
LAM RES CORP0 citations47
US12400880B2Aug 26, 2025
Apparatuses for uniform fluid delivery in a multi-station semiconductor processing chamber
LAM RES CORP0 citations41