Inventor
NISHIURA SHINICHI
JP21 patents
Patents
21 patentsUS6222274B1Apr 24, 2001
Bonding wire loop shape for a semiconductor device
SHINKAWA KK24 citations92
US6182885B1Feb 6, 2001
Wire bonding method
SHINKAWA KK19 citations92
US6112974ASep 5, 2000
Wire bonding method
SHINKAWA KK48 citations92
US5989995ANov 23, 1999
Semiconductor device and wire bonding method therefor
SHINKAWA KK40 citations92
US5967401AOct 19, 1999
Wire bonding method
SHINKAWA KK26 citations92
US5961029AOct 5, 1999
Wire bonding method
SHINKAWA KK37 citations92
US6315190B1Nov 13, 2001
Wire bonding method
SHINKAWA KK16 citations84
US6270000B1Aug 7, 2001
Wire bonding method
SHINKAWA KK15 citations84
US6784394B2Aug 31, 2004
Ball formation method and ball forming device used in a wire bonding apparatus
SHINKAWA KK11 citations73
US6343733B1Feb 5, 2002
Wire bonding method
SHINKAWA KK12 citations73
US6250539B1Jun 26, 2001
Wire bonding method
SHINKAWA KK8 citations73
US6213384B1Apr 10, 2001
Wire bonding method
SHINKAWA KK11 citations73
US6164518ADec 26, 2000
Wire bonding method and apparatus
SHINKAWA KK6 citations72
US7644852B2Jan 12, 2010
Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus
SHINKAWA KK7 citations69
US6845897B2Jan 25, 2005
Ultrasonic horn for a bonding apparatus
SHINKAWA KK2 citations62
US6422448B2Jul 23, 2002
Ultrasonic horn for a bonding apparatus
SHINKAWA KK6 citations62
US7658313B2Feb 9, 2010
Ball forming device in a bonding apparatus and ball forming method
SHINKAWA KK5 citations61
US7299966B2Nov 27, 2007
Initial ball forming method for wire bonding wire and wire bonding apparatus
SHINKAWA KK3 citations61
US6874673B2Apr 5, 2005
Initial ball forming method for wire bonding wire and wire bonding apparatus
SHINKAWA KK5 citations61
US6305594B1Oct 23, 2001
Wire bonding method and apparatus
SHINKAWA KK3 citations61
US6758383B2Jul 6, 2004
Transducer for a bonding apparatus
SHINKAWA KK5 citations54