Inventor

KWEON YOUNG DO

KR81 patents

⚠️ This page may combine multiple inventors who share the name “KWEON YOUNG DO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KWEON YOUNG DO

SAMSUNG ELECTRO MECH

Wafer level package and manufacturing method thereof

Semiconductor package and method for manufacturing thereof

Chip embedded board and method of manufacturing the same

Via structure having open stub and printed circuit board having the same

Power inductor and manufacturing method thereof

Inductor and method for manufacturing the same

Coil component and manufacturing method thereof

Chip inductor and method for manufacturing the same

Semiconductor package

Method of manufacturing a semiconductor package

Method of manufacturing wafer level package

Common mode filter and method of manufacturing the same

Common mode filter and method of manufacturing the same

Common mode filter

Die package and method of manufacturing the same

Circuit board and method for manufacturing the same

Common mode filter with ESD protection pattern built therein

Method of manufacturing wafer level package including coating and removing resin over the dicing lines

Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar

Method for manufacturing interposer

SAMSUNG ELECTRONICS CO LTD

Reduced noise semiconductor package stack

Semiconductor device package structure having column leads and a method for production thereof

Semiconductor packages having split die pad

Method for simultaneously manufacturing chip-scale package using lead frame strip with a plurality of lead frames

Packing structure of semiconductor packages

Lead-on-chip semiconductor package and method for making the same

PARK SEUNG WOOK

Method of manufacturing a dual face package

Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer

Dual face package having resin insulating layer

Stacked wafer level package and method of manufacturing the same

Method of manufacturing stacked wafer level package

Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure

MICRON TECHNOLOGY INC

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of fabricating microelectronic devices

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

CHIPPAC INC

Self-coplanarity bumping shape for flip chip

Chip scale package with flip chip interconnect

Self-coplanarity bumping shape for flip-chip

Self-coplanarity bumping shape for flip chip

AMKOR TECH SINGAPORE HOLDING PTE LTD

Semiconductor package using cavity substrate and manufacturing methods

Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby

Carrier assisted substrate method of manufacturing an electronic device and electronic device produced thereby

SAMSUNG ELECTRO & MDASH MECHANICS CO LTD

Method for manufacturing a semiconductor package

KWEON YOUNG DO

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

KIM JIN GU

Interposer-embedded printed circuit board

CHUNG YUL-KYO

Semiconductor chip package and printed circuit board

AMKOR TECHNOLOGY INC

Semiconductor package using cavity substrate and manufacturing methods

KIM WOON-CHUN

Semiconductor package with a metal post